CYIL2SM1300AA-GWCES Cypress Semiconductor Corp, CYIL2SM1300AA-GWCES Datasheet - Page 40

no-image

CYIL2SM1300AA-GWCES

Manufacturer Part Number
CYIL2SM1300AA-GWCES
Description
Manufacturer
Cypress Semiconductor Corp
Type
CMOSr
Datasheet

Specifications of CYIL2SM1300AA-GWCES

Sensor Image Color Type
Monochrome
Sensor Image Size Range
>= 480,000Pixels
Sensor Image Size
1280x1024Pixels
Operating Supply Voltage (typ)
2.5V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Through Hole
Lead Free Status / RoHS Status
Not Compliant
Table 22. Mechanical Specifications
Document Number: 001-24599 Rev. *E
Die
(Pin 1 is located
bottom left)
Glass Lid
Mechanical Shock
Vibration
Mounting Profile
Recommended
Socket Manufacturer
Parameter
Die thickness
Die position, X offset to the package center
Die position, Y offset to the package center
Die position, X tilt
Die position, Y tilt
Die placement accuracy in package
Die rotation accuracy
Optical center referenced from the die center (X-dir)
Optical center referenced from the die center (Y-dir)
Distance from PCB plane to top of the die surface
Distance from top of the die surface to top of the glass lid
XY size
Thickness
Spectral range for optical coating of window
Reflection coefficient for window (refer to
JESD22-B104C; Condition G
JESD22-B103B; Condition 1
Pb-free wave soldering profile for pin grid array package if no socket is used
Andon Electronics (www.andonelectronics.com)
Description
Figure
37)
BGA Socket: 10-24-05-168-319T-P27-L14
Min
400
NA
NA
-50
NA
NA
NA
NA
NA
NA
NA
NA
NA
20
-1
-1
-1
Thru Hole: 10-24-05-168-347T-P27-L14
27.4 x 27.4
+2280
2000
-150
-121
1.75
1.15
<0.8
Typ
750
-42
0.9
0
0
0
0
-
-
CYIL2SM1300AA
1100
2000
Max
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
NA
50
1
1
1
Page 40 of 43
Units
deg
deg
deg
mm
mm
mm
mm
µm
µm
µm
µm
µm
µm
nm
Hz
%
G
[+] Feedback

Related parts for CYIL2SM1300AA-GWCES