MC33941EG Freescale, MC33941EG Datasheet - Page 3

• Manufacturer Part Number: MC33941EG
• Manufacturer: Freescale

Specifications of MC33941EG

• Lead Free Status / RoHS Status: Compliant

Sensors
Freescale Semiconductor
Table 1. Maximum Ratings
damage to the device.
ELECTRICAL RATINGS
THERMAL RATINGS
Notes
Peak V
Double Battery
ESD Voltage
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Thermal Resistance
Soldering Temperature
Junction-to-Ambient
Junction-to-Case
Junction-to-Board
1.
2.
3.
4.
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
Human Body Model (C
Machine Model (C
Charge Device Model (CDM), Robotic (C
1 Minute Maximum T
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance. In accordance with SEMI G38-
87 and JEDEC JESD51-2 with the single layer board horizontal.
Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MILSPEC 883
Method 1012.1) with the cold plate temperature used for the case temperature.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface
of the board near the package.
Terminal soldering temperature limit is for 10 seconds maximum duration. The device is not designed for immersion soldering. Exceeding
these limits may cause malfunction or permanent damage to the device.
PWR
Voltage
(2)
(3)
ZAP
(1)
(4)
A
= 200 pF, R
ZAP
= 30°C
= 100 pF, R
ZAP
Rating
= 0 W)
ZAP
ZAP
= 1500 W)
= 4.0pF)
V
Symbol
V
DBLBAT
V
T
PWRPK
R
R
R
ESD
STG
T
T
θ
θ
θ
A
J
JA
JC
JB
-55 to 150
-40 to 110
-40 to 150
Value
±2000
±1200
26.5
±200
40
0.2
3.0
41
MC33941
°C/W
Unit
°C
°C
°C
V
V
V
3