ICS85454AKT IDT, Integrated Device Technology Inc, ICS85454AKT Datasheet - Page 7

• Manufacturer Part Number: ICS85454AKT
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of ICS85454AKT

• Function: Clock Multiplexer
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Package Type: VFQFN
• Pin Count: 16
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Not Compliant

T
The expose metal pad provides heat transfer from the device to
the P.C. board. The expose metal pad is ground pad connected
to ground plane through thermal via. The exposed pad on the
device to the exposed metal pad on the PCB is contacted through
IDT
2.5V LVDS D
Figure 2 shows a typical ter mination for LVDS driver in
characteristic impedance of 100Ω differential (50Ω single)
HERMAL
ICS85454
DUAL 2:1 AND 1:2 DIFFERENTIAL-TO-LVDS MULTIPLEXER
™
/ ICS
™
DUAL 2:1 AND 1:2 LVDS MULTIPLEXER
R
ELEASE
RIVER
SIGNAL
TRACE
SOLDER M ASK
P
T
ATH
ERMINATION
F
GROUND PLANE
IGURE
3. P.C. B
2.5V
F
LVDS_Driv er
IGURE
100 Ohm Differential Transmission Line
OARD FOR
2. T
100Ω Ω Ω Ω Ω Differential Transmission Line
YPICAL
E
XPOSED
LVDS D
THERM AL VIA
P
7
RIVER
AD
transmission line environment. For buffer with multiple LVDS driver,
it is recommended to terminate the unused outputs.
solder as shown in Figure 3. For further information, please refer
to the Application Note on Surface Mount Assembly of Amkor’s
Thermally /Electrically Enhance Leadframe Base Package, Amkor
Technology.
T
EXPOSED PAD
HERMAL
T
R1
100
ERMINATION
R
ELEASE
Expose Metal Pad
(GROUND PAD)
P
+
-
ATH
2.5V
E
SOLDER
ICS85454 REV. B FEBRUARY 24, 2009
XAMPLE
SIGNAL
TRACE