BAP70-02 T/R NXP Semiconductors, BAP70-02 T/R Datasheet - Page 3

BAP70-02 T/R

Manufacturer Part Number
BAP70-02 T/R
Description
Manufacturer
NXP Semiconductors
Type
Attenuatorr
Datasheet

Specifications of BAP70-02 T/R

Configuration
Single
Forward Current
100mA
Forward Voltage
1.1V
Power Dissipation
415mW
Operating Temperature Classification
Military
Reverse Voltage
50V
Package Type
I-IGIA
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
100@0.5mAOhm
Maximum Series Resistance @ Maximum If
1.9@100mAOhm
Typical Carrier Life Time
1.25us
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Applications Frequency Range
VHF
Lead Free Status / RoHS Status
Compliant
NXP Semiconductors
THERMAL CHARACTERISTICS
GRAPHICAL DATA
R
handbook, halfpage
SYMBOL
Silicon PIN diode
th j-s
f = 100 MHz; T
Fig.2
( )
r D
10
10
10
10
1
3
2
1
Forward resistance as a function of forward
current; typical values.
thermal resistance from junction to soldering point
j
= 25 C.
1
10
I F (mA)
PARAMETER
MCE007
10
Rev. 05 - 2 January 2008
2
handbook, halfpage
f = 1 MHz; T
Fig.3
(fF)
C d
600
500
400
300
200
100
0
0
Diode capacitance as a function of reverse
voltage; typical values.
j
= 25 C.
5
10
VALUE
145
Product specification
15
BAP70-02
V R (V)
MCE008
UNIT
K/W
20
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