HSMP389VTR1 Avago Technologies US Inc., HSMP389VTR1 Datasheet

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HSMP-389x Series, HSMP-489x Series Surface Mount RF PIN Switch Diodes Data Sheet Description/Applications The HSMP-389x series is optimized for switching appli- cations where low resistance at low current and low ca- pacitance are required. The HSMP-489x series products feature ultra low parasitic inductance. These products are specifically designed for use at frequencies which are much higher than the upper limit for conventional ...

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Package Lead Code Identification, SOT-23/143 (Top View) SERIES SINGLE #0 #2 COMMON COMMON ANODE CATHODE #3 #4 UNCONNECTED DUAL ANODE PAIR 4890 #5 RING QUAD UNDER DEVELOPMENT Absolute Maximum Ratings T = +25°C [1] C ...

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Electrical Specifications 25°C, each diode C Package Part Number Marking Lead HSMP- Code Code Configuration 3890 G0 0 Single [1] 3892 G2 2 Series [1] 3893 G3 3 Common Anode [1] 3894 ...

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HSMP-389x Series Typical Performance, T 100 10 1 0.1 0.01 0 100 I – FORWARD BIAS CURRENT (mA) F Figure 1. Total RF Resistance vs. Forward Bias Current. 200 160 V = –2V R 120 ...

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Typical Applications for Multiple Diode Products “ON” “OFF” Figure 8. HSMP-389L Unconnected Trio used in a Positive Voltage, High Isolation Switch. Bias Ant λ 4 Xmtr bias PA λ 4 ...

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Typical Applications for Multiple Diode Products RF COMMON RF 1 BIAS 1 Figure 12. Simple SPDT Switch, Using Only Positive Current. RF COMMON RF 1 Figure 14. Switch Using Both Positive and Negative Bias Current. 6 (continued ...

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Typical Applications for HSMP-489x Low Inductance Series Microstrip Series Connection for HSMP-489x Series In order to take full advantage of the low inductance of the HSMP-489x series when using them in series ap- plications, both lead 1 and lead 2 should be connected together, as shown in Figure 17 HSMP-489x Figure 16. Internal Connections. Figure 16. Internal Connections. Figure 17. ...

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Assembly Information 0.026 0.035 0.016 Figure 22. PCB Pad Layout, SOT-363. (dimensions in inches). 0.026 0.035 0.016 Figure 23. PCB Pad Layout, SOT-323. (dimensions in inches). 0.037 0.95 0.035 0.9 0.031 0.8 inches DIMENSIONS IN mm Figure 24. PCB Pad ...

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SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g vapor phase reflow, wave soldering, etc.) cir- cuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity ...

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Package Dimensions Outline 23 (SOT-23 XXX SYMBOL Notes: e2 XXX-package marking E Drawings are not to scale L Outline 143 (SOT-143 ...

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Package Characteristics Lead Material Lead Finish Maximum Soldering Temperature Minimum Lead Strength Typical Package Inductance Typical Package Capacitance Ordering Information Specify part number followed by option. For example: HSMP - 389x - xxx Option Descriptions -BLKG = Bulk, 100 pcs. per antistatic bag -TR1G = Tape and Reel, 3000 devices per 7" reel -TR2G = Tape and Reel, 10,000 devices per 13" reel Tape and Reeling conforms to Electronic Industries RS-481, “Taping of Surface Mounted Components for Automated Placement. ” Device Orientation REEL CARRIER TAPE USER FEED DIRECTION COVER TAPE For Outline ...

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Tape Dimensions and Product Orientation For Outline SOT- MAX A 0 DESCRIPTION SYMBOL CAVITY LENGTH A 3.15 0 WIDTH B 2.77 0 DEPTH K 1.22 0 PITCH P 4.00 BOTTOM HOLE DIAMETER D ...

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Tape Dimensions and Product Orientation For Outlines SOT-323, -363 DESCRIPTION SYMBOL CAVITY LENGTH A 0 WIDTH B 0 DEPTH K 0 PITCH P BOTTOM HOLE DIAMETER D 1 PERFORATION DIAMETER D PITCH ...