BAP51-02 NXP Semiconductors, BAP51-02 Datasheet - Page 6

General purpose PIN diode in a SOD523 ultra small SMD plastic package

BAP51-02

Manufacturer Part Number
BAP51-02
Description
General purpose PIN diode in a SOD523 ultra small SMD plastic package
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP51-02

Configuration
Single
Forward Current
50mA
Forward Voltage
1.1V
Power Dissipation
715mW
Operating Temperature Classification
Military
Package Type
I-IGIA
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
9@0.5mAOhm
Maximum Series Resistance @ Maximum If
2.5@10mAOhm
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAP51-02
Manufacturer:
NXP
Quantity:
51 000
Company:
Part Number:
BAP51-02
Quantity:
200
Part Number:
BAP51-02+115
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
BAP51-02,115
Manufacturer:
HARRIS
Quantity:
1 539
NXP Semiconductors
Revision history
Revision history
Document ID
BAP51-02_N_3
Modifications:
BAP51-02_2
(9397 750 07151)
BAP51-02_N_1
(9397 750 06152)
Release date
20080102
20000706
19990628
Package outline drawing on page 4 changed
Data sheet status
Product data sheet
Product specification
Preliminary specification
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Change notice
-
-
-
General purpose PIN diode
Supersedes
BAP51-02_2
BAP51-02_N_1
-
Document identifier: BAP51-02_N_3
BAP51-02
Date of release: 2 January 2008
All rights reserved.

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