MT47H64M8CF-25:F TR Micron Technology Inc, MT47H64M8CF-25:F TR Datasheet - Page 52

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MT47H64M8CF-25:F TR

Manufacturer Part Number
MT47H64M8CF-25:F TR
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet

Specifications of MT47H64M8CF-25:F TR

Organization
64Mx8
Density
512Mb
Address Bus
16b
Access Time (max)
400ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
0C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
205mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
Power and Ground Clamp Characteristics
Table 25: Input Clamp Characteristics
Figure 19: Input Clamp Characteristics
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. Q 10/10 EN
Voltage Across Clamp (V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
Power and ground clamps are provided on the following input-only balls: Address balls,
bank address balls, CS#, RAS#, CAS#, WE#, ODT, and CKE.
25
20
15
10
5
0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
Minimum Power Clamp Current
Voltage Across Clamp (V)
(mA)
52
11.0
13.5
16.0
18.2
21.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
1.0
2.5
4.7
6.8
9.1
Power and Ground Clamp Characteristics
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
Minimum Ground Clamp Current
© 2004 Micron Technology, Inc. All rights reserved.
(mA)
11.0
13.5
16.0
18.2
21.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.0
0.1
1.0
2.5
4.7
6.8
9.1

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