MT36HTF51272FZ-667H1N8 Micron Technology Inc, MT36HTF51272FZ-667H1N8 Datasheet - Page 10

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MT36HTF51272FZ-667H1N8

Manufacturer Part Number
MT36HTF51272FZ-667H1N8
Description
MODULE DDR2 SDRAM 4GB 240FBDIMM
Manufacturer
Micron Technology Inc
Series
-r

Specifications of MT36HTF51272FZ-667H1N8

Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
240FBDIMM
Device Core Size
72b
Organization
512Mx72
Chip Density
1Gb
Package Type
FBDIMM
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Number Of Elements
36
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 95C
Operating Temperature Classification
Commercial
Pin Count
240
Mounting
Socket
Memory Type
DDR2 SDRAM
Memory Size
4GB
Speed
667MT/s
Features
-
Package / Case
240-FBDIMM
Lead Free Status / RoHS Status
Supplier Unconfirmed
Serial Presence-Detect
Table 12:
Table 13:
Serial Presence-Detect Data
PDF: 09005aef83d491e1Source: 09005aef83d49311
htf36c512x72fz.fm - Rev. A 11/09 EN
Parameter/Condition
Parameter/Condition
EEPROM and AMB supply voltage
Input high voltage: Logic 1; all inputs
Input low voltage: Logic 0; all inputs
Output low voltage: I
Input leakage current: V
Output leakage current:
Standby current
Power supply current, READ: SCL clock frequency = 100 kHz
Power supply current, WRITE: SCL clock frequency = 100 kHz
SCL LOW to SDA data-out valid
Time the bus must be free before a new transition can start
Data-out hold time
SDA and SCL fall time
Data-in hold time
Start condition hold time
Clock HIGH period
Noise suppression time constant at SCL, SDA inputs
Clock LOW period
SDA and SCL rise time
SCL clock frequency
Data-in setup time
Start condition setup time
Stop condition setup time
WRITE cycle time
Serial Presence-Detect EEPROM DC Operating Conditions
All voltages referenced to V
Serial Presence-Detect EEPROM AC Operating Conditions
All voltages referenced to V
OUT
Notes: 1. To avoid spurious start and stop conditions, a minimum delay is placed between SCL = 1
IN
V
= 3mA
OUT
= GND to V
For the latest serial presence-detect data, refer to Micron's SPD page:
www.micron.com/SPD.
2. This parameter is sampled.
3. For a restart condition, or following a WRITE cycle.
4. The SPD EEPROM WRITE cycle time (
= GND to V
and the falling or rising edge of SDA.
write sequence to the end of the EEPROM internal ERASE/PROGRAM cycle. During the
WRITE cycle, the EEPROM bus interface circuit is disabled, SDA remains HIGH due to pull-
up resistance, and the EEPROM does not respond to its slave address.
DD
SS
SS
DD
10
4GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
Symbol
Symbol
t
t
t
t
t
HD:DAT
V
HD:STA
SU:DAT
SU:STO
SU:STA
t
t
t
I
t
HIGH
LOW
f
DDSPD
WRC
V
I
t
t
V
CCW
BUF
V
I
SCL
I
CCR
AA
DH
t
I
t
t
LO
SB
t
WRC) is the time from a valid stop condition of a
OL
LI
R
IH
F
IL
I
Micron Technology, Inc., reserves the right to change products or specifications without notice.
V
Min
DDSPD
200
100
0.2
1.3
0.6
0.6
1.3
0.6
0.6
0
Min
0.10
0.05
–0.6
1.6
0.4
3
2
× 0.7
Serial Presence-Detect
Max
300
400
0.9
0.3
50
10
©2009 Micron Technology, Inc. All rights reserved.
V
V
DDSPD
DDSPD
Max
3.6
0.4
3
3
4
1
3
Units
kHz
+ 0.5
× 0.3
ms
µs
µs
ns
ns
µs
µs
µs
ns
µs
µs
ns
µs
µs
Notes
Units
mA
mA
µA
µA
µA
V
V
V
V
1
2
2
3
4

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