CNY171SR2M Fairchild Semiconductor, CNY171SR2M Datasheet
CNY171SR2M
Specifications of CNY171SR2M
Related parts for CNY171SR2M
CNY171SR2M Summary of contents
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... CEO White Package (-M Suffi Schematic ©2004 Fairchild Semiconductor Corporation CNY17-1, CNY17-3, CNY17-2, CNY17-4 Rev. 1.0.2 Applications ■ Power supply regulators ■ Digital logic inputs ■ Microprocessor inputs ■ Appliance sensor systems ■ Industrial controls Description The CNY17 series consists of a Gallium Arsenide IRED coupled with an NPN phototransistor. Black Package (No -M Suffi ...
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Parameters TOTAL DEVICE Storage Temperature Operating Temperature Lead Solder Temperature Total Device Power Dissipation @ 25°C (LED plus detector) Derate Linearly From 25°C EMITTER Continuous Forward Current Reverse Voltage Forward Current - Peak (1 µs pulse, 300 pps) LED Power ...
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Isolation Characteristics Characteristic Test Conditions Symbol Input-Output Isolation Voltage Hz min. Isolation Resistance V I-O Isolation Capacitance V I-O Note * 5300 Vac(rms) for 1 minute equates to approximately 9000 Vac (pk) for 1 ...
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Transfer Characteristics DC Characteristics Fall-Time (Fig. 19 and Fig. 20 Storage Time (Fig. 19 and Fig. I 20) I CNY17-1, CNY17-3, CNY17-2, CNY17-4 Rev. 1.0 25°C Unless otherwise specified.) (Continued) A Test Conditions Symbol ...
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Fig.1 Normalized CTR vs. Forward Current (Black Package 25˚C A 1.2 1.0 0.8 0.6 0.4 0.2 0 FORWARD CURRENT (mA) F Fig. 3 Normalized CTR vs. Ambient Temperature ...
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Fig. 7 CTR vs. RBE (Saturated) (Black Package) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 10 100 - BASE RESISTANCE (k Ω Fig. 9 Switching Speed vs. Load Resistor (Black Package) 1000 I = ...
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Fig. 13 Normalized t (Black Package) 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 10 100 1000 - BASE RESISTANCE (k Ω Fig. 15 LED Forward Voltage vs. Forward Current (Black Package) ...
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INPUT Figure 19. Switching Time Test Circuit CNY17-1, CNY17-3, CNY17-2, CNY17-4 Rev. 1.0 10 90% OUTPUT ( Figure 20. Switching Time Test Circuit 8 ...
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Black Package (No -M Suffix) Package Dimensions (Through Hole) PIN 1 ID. 0.270 (6.86) 0.240 (6.10) 0.350 (8.89) 0.330 (8.38) 0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.115 (2.92) 0.020 (0.51) 0.154 (3.90) MIN 0.100 (2.54) 0.016 (0.40) 0.008 (0.20) 0.022 ...
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White Package (-M Suffix) Package Dimensions (Through Hole) 0.350 (8.89) 0.320 (8.13) Pin 1 ID 0.260 (6.60) 0.240 (6.10) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.100 (2.54) 0.016 ...
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Ordering Information Black Package Option (No Suffi 300 300W .300W 3S 3SD .3SD Carrier Tape Specifications (Black Package, No Suffix) 4.85 ± 0.20 0.30 ± 0.05 13.2 ± 0.2 0.1 MAX Carrier Tape Specifications (White Package, -M ...
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Marking Information Definitions Reflow Profile (Black Package, No Suffix) 300 250 225 C peak 200 150 100 Time above 183° C, 60–150 sec 50 Ramp C/sec 0 0 0.5 1 1.5 ...
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Reflow Profile (White Package, -M Suffix) 300 280 260 240 220 200 180 160 °C 140 120 100 CNY17-1, CNY17-3, CNY17-2, CNY17-4 Rev. 1.0.2 260°C Time above 183° Sec 1.822°C/Sec Ramp up ...
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... TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. FAST ACEx™ ActiveArray™ FASTr™ Bottomless™ FPS™ Build it Now™ FRFET™ CoolFET™ ...