MC9S08QE128CLH Freescale, MC9S08QE128CLH Datasheet - Page 36

• Manufacturer Part Number: MC9S08QE128CLH
• Manufacturer: Freescale

Specifications of MC9S08QE128CLH

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 50.33MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 8KB
• # I/os (max): 54
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 22-chx12-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 128KB
• Lead Free Status / RoHS Status: Compliant

Package Information
36
SEATING
PLANE
–H–
–T–
–L–
DATE 09/21/95
0.05 (0.002)
20
1
4X
C
80
21
3X
0.20 (0.008) H
Figure 26. 80-pin LQFP Package Drawing (Case 917A, Doc #98ASS23237W)
VIEW Y
S1
C2
A1
S
C1
(W)
VIEW AA
A
S
L–M
–N–
N
(Z)
8X
(K)
E
2
1
MC9S08QE128 Series Data Sheet, Rev. 7
2X R
40
61
R1
4X 20 TIPS
60
41
–M–
0.20 (0.008) T
B1
VIEW AA
CASE 917A-02
0.25 (0.010)
V1
0.10 (0.004) T
ISSUE C
GAGE
PLANE
B
V
L–M
N
NOTES:
C L
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –H–.
SEATING PLANE –T–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.460
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
DIM
A1
B1
C1
C2
R1
S1
V1
01
02
G
W
A
B
C
D
E
F
J
K
P
S
U
V
Z
0
0.13 (0.005)
AB
AB
ROTATED 90 CLOCKWISE
MILLIMETERS
MIN
0.04
1.30
0.22
0.40
0.17
0.09
0.10
0.09
–––
J
14.00 BSC
14.00 BSC
0.325 BSC
16.00 BSC
16.00 BSC
SECTION AB–AB
7.00 BSC
7.00 BSC
0.65 BSC
0.50 REF
8.00 BSC
8.00 BSC
0.20 REF
1.00 REF
0
0
9
Í Í Í Í
Ç Ç Ç
Í Í Í Í
Ç Ç Ç
PLATING
MAX
1.60
0.24
1.50
0.38
0.75
0.33
0.27
0.20
0.16
10
–––
14
VIEW Y
M
F
D
0.002
0.051
0.009
0.016
0.007
0.004
0.004
0.004
Freescale Semiconductor
MIN
T
–––
0.551 BSC
0.276 BSC
0.551 BSC
0.276 BSC
0.026 BSC
0.020 REF
0.013 REF
0.630 BSC
0.315 BSC
0.630 BSC
0.315 BSC
0.008 REF
0.039 REF
0
0
9
INCHES
L–M
G
U
MAX
0.063
0.009
0.059
0.015
0.030
0.013
0.011
0.008
0.006
10
–––
14
S
–X–
X= L, M, N
METAL
BASE
N
P
S