LFXP10C-3FN256C LATTICE SEMICONDUCTOR, LFXP10C-3FN256C Datasheet - Page 115

• Manufacturer Part Number: LFXP10C-3FN256C
• Description: FPGA LatticeXP Family 10000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 256-Pin FBGA Tray
• Manufacturer: LATTICE SEMICONDUCTOR

Specifications of LFXP10C-3FN256C

• Package: 256FBGA
• Family Name: LatticeXP
• Device Logic Units: 10000
• Maximum Internal Frequency: 320 MHz
• Typical Operating Supply Voltage: 1.8|2.5|3.3 V
• Maximum Number Of User I/os: 188
• Ram Bits: 221184
• Re-programmability Support: Yes

Pinout Information
Lattice Semiconductor
LatticeXP Family Data Sheet
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
• Thermal Management document
• Technical Note TN1052 - Power Estimation and Management for LatticeECP/EC and LatticeXP Devices
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from 
www.latticesemi.com/software
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