ICS854S202AYIT IDT, Integrated Device Technology Inc, ICS854S202AYIT Datasheet - Page 13

• Manufacturer Part Number: ICS854S202AYIT
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Clock Multiplexerr

Specifications of ICS854S202AYIT

• Mode Of Operation: Differential
• Output Frequency: >3000MHz
• Output Logic Level: LVDS
• Operating Supply Voltage (min): 3.135V
• Operating Supply Voltage (typ): 3.3V
• Operating Supply Voltage (max): 3.465V
• Package Type: TQFP
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / RoHS Status: Not Compliant

T
This section provides information on power dissipation and junction temperature for the ICS854S202I-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS854S202I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 60.4°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow, and
the type of board (single layer or multi-layer).
IDT
ABLE
ICS854S202I
12:2, DIFFERENTIAL-LVDS MULTIPLEXER
™
The equation for Tj is as follows: Tj =
Tj = Junction Temperature
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
85°C + 0.399W * 60.4°C/W = 109.1°C. This is well below the limit of 125°C.
/ ICS
JA
A
Multi-Layer PCB, JEDEC Standard Test Boards
6. T
= Ambient Temperature
= Junction-to-Ambient Thermal Resistance
Power (core)
™
LVDS MULTIPLEXER
HERMAL
R
MAX
ESISTANCE
= V
DD_MAX
* I
JA
DD_MAX
FOR
48-L
= 3.465V * 115mA = 398.48mW
JA
DD
JA
= 3.3V + 5% = 3.465V, which gives worst case results.
vs. Air Flow (Linear Feet per Minute)
EAD
P
* Pd_total + T
OWER
LQFP, F
ORCED
C
A
ONSIDERATIONS
70.2°C/W
13
C
ONVECTION
0
TM
devices is 125°C.
60.4°C/W
200
ICS854S202AYI REV. A JANUARY 26, 2007
JA
56.9°C/W
must be used. Assuming a
500
PRELIMINARY