STM32F217ZET6 STMicroelectronics, STM32F217ZET6 Datasheet - Page 142

• Manufacturer Part Number: STM32F217ZET6
• Description: MCU ARM 512KB FLASH 144LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F217ZET6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 114
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 132K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 24x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-11188

Package characteristics
Figure 80. UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm, package outline
1. Drawing is not to scale.
Table 84.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
142/158
Symbol
ddd
eee
A1
A2
A3
A4
fff
A
D
E
b
e
F
UFBGA176+25 - ultra thin fine pitch ball grid array 10 × 10 × 0.6 mm mechanical data
0.460
0.050
0.400
0.270
0.300
9.950
9.950
0.600
0.400
Min
C
A
Seating plane
A2
R
A
A4
millimeters
15
A3
10.000
10.000
0.530
0.080
0.450
0.130
0.320
0.350
0.650
0.450
0.120
0.150
0.080
Typ
e
Doc ID 17050 Rev 4
D
10.050
10.050
0.610
0.110
0.500
0.370
0.400
0.700
0.500
Max
Øb
Ø
Ø
eee M C A B
(176 balls)
fff
F
M
1
C
0.0181
0.0157
0.0106
0.0118
0.3740
0.3740
0.0236
0.0157
0.002
Min
A1
F
e
Ball A1
A
E
STM32F215xx, STM32F217xx
B
ddd
C
A0E7_ME
inches
0.0209
0.0031
0.0177
0.0051
0.0126
0.0138
0.3937
0.3937
0.0256
0.0177
0.0047
0.0059
0.0031
Typ
(1)
0.0240
0.0043
0.0197
0.0146
0.0157
0.3957
0.3957
0.0276
0.0197
Max