SY89832UMG Micrel Inc, SY89832UMG Datasheet - Page 10

• Manufacturer Part Number: SY89832UMG
• Description: IC BUFFER/XLATOR 1:4 LVDS 16MLF
• Manufacturer: Micrel Inc
• Series: Precision Edge®r
• Type: Fanout Buffer (Distribution), Translatorr

Specifications of SY89832UMG

• Number Of Circuits: 1
• Ratio - Input:output: 1:4
• Differential - Input:output: Yes/Yes
• Input: CML, LVDS, LVPECL
• Output: LVDS
• Frequency - Max: 2.5GHz
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-MLF®, QFN
• Frequency-max: 2.5GHz
• Clock Ic Type: Clock Divider / Fan-out Buffer
• Frequency: 2.5GHz
• No. Of Outputs: 4
• Ic Output Type: LVDS
• Supply Current: 75mA
• Supply Voltage Range: 2.375V To 2.325V
• Digital Ic Case Style: MLF
• Number Of Outputs: 8
• Operating Supply Voltage (max): 2.625V
• Operating Temp Range: -40C to 85C
• Propagation Delay Time: 0.57ns
• Operating Supply Voltage (min): 2.375V
• Mounting: Surface Mount
• Pin Count: 16
• Operating Supply Voltage (typ): 2.5V
• Package Type: MLF
• Input Frequency: 2.5GHz
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 576-1432

Micrel, Inc.
August 2007
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
16-PIN EPAD MicroLeadFrame
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL
+ 1 [phone]
Package Notes:
Note 1.
Note 2.
(Always solder, or equivalent, the exposed pad to the PCB)
Heat Dissipation
PCB Thermal Consideration for 16-Pin MLF
Micrel for any damages resulting from such use or sale.
Package meets Level 2 moisture sensitivity classification, and are shipped in dry-pack form.
Exposed pads must be soldered to a ground for proper thermal management.
®
(MLF-16)
FAX
© 2005 Micrel, Incorporated.
+ 1 [phone]
10
CompSide Island
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
WEB
http://www.micrel.com
®
Package
EP- Exposed Pad
Die
Package
V
V
EE
EE
[e-mail] or [phone]
Precision Edge
M9999-082407
SY89832U
®