ICS8536AG-01LF IDT, Integrated Device Technology Inc, ICS8536AG-01LF Datasheet - Page 15

• Manufacturer Part Number: ICS8536AG-01LF
• Description: IC CLK FAN BUFF MUX 1:6 24TSSOP
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Fanout Buffer (Distribution), Multiplexerr
• Series: HiPerClockS™r

Specifications of ICS8536AG-01LF

• Number Of Circuits: 1
• Ratio - Input:output: 3:6
• Differential - Input:output: Yes/Yes
• Input: HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL, Crystal
• Output: LVPECL
• Frequency - Max: 700MHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 24-TSSOP
• Frequency-max: 700MHz
• Number Of Clock Inputs: 3
• Output Frequency: 700MHz
• Output Logic Level: LVPECL
• Operating Supply Voltage (min): 2.375V
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465V
• Package Type: TSSOP
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 24
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 800-1961-5; 8536AG-01LF; ICS8536AG-01LF

This section provides information on power dissipation and junction temperature for the ICS8536-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8536-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for HiPerClockS
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
flow and a multi-layer board, the appropriate value is 84.6°C/W per Table 7 below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
T
IDT
ABLE
ICS8536-01
LOW SKEW, 1-TO-6, CRYSTAL/LVCMOS/DIFFERENTIAL-TO-3.3V, 2.5V LVPECL FANOUT BUFFER
™
/ ICS
7. T
Multi-Layer PCB, JEDEC Standard Test Boards
Power (core)
Power (outputs)
If all outputs are loaded, the total power is 6 * 30mW = 180mW
Total Power
The equation for Tj is as follows: Tj =
Tj = Junction Temperature
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
70°C + 0.475W * 84.6°C/W = 110.2°C. This is well below the limit of 125°C.
™
JA
A
3.3V, 2.5V LVPECL FANOUT BUFFER
= Ambient Temperature
HERMAL
= Junction-to-Ambient Thermal Resistance
R
MAX
ESISTANCE
_MAX
= V
MAX
(3.465V, with all outputs switching) = 294.525mW + 180mW = 474.525mW
= 30mW/Loaded Output pair
CC_MAX
* I
JA
EE_MAX
FOR
= 3.465V * 85mA = 294.525mW
24-
CC
PIN
= 3.3V + 5% = 3.465V, which gives worst case results.
P
JA
TSSOP, F
by Velocity (Meters per Second)
OWER
JA
* Pd_total + T
ORCED
C
ONSIDERATIONS
A
84.6°C/W
C
15
ONVECTION
0
TM
devices is 125°C.
80.3°C/W
1
ICS8536AG-01 REV. A FEBRUARY 24, 2009
JA
must be used. Assuming no air
78.1°C/W
2.5