NB6L11SMNG ON Semiconductor, NB6L11SMNG Datasheet - Page 3

IC BUFFER/XLATOR DIFF 1:2 16-QFN

NB6L11SMNG

Manufacturer Part Number
NB6L11SMNG
Description
IC BUFFER/XLATOR DIFF 1:2 16-QFN
Manufacturer
ON Semiconductor
Series
AnyLevel™r
Type
Fanout Buffer (Distribution), Translatorr
Datasheet

Specifications of NB6L11SMNG

Number Of Circuits
1
Ratio - Input:output
1:2
Differential - Input:output
Yes/Yes
Input
CML, LVCMOS, LVDS, LVPECL, LVTTL
Output
LVDS
Frequency - Max
2GHz
Voltage - Supply
2.375 V ~ 3.63 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-TFQFN Exposed Pad
Frequency-max
2GHz
Number Of Outputs
4
Operating Supply Voltage (max)
2.625V
Operating Temp Range
-40C to 85C
Propagation Delay Time
0.45ns
Operating Supply Voltage (min)
2.375V
Mounting
Surface Mount
Pin Count
16
Operating Supply Voltage (typ)
2.5V
Package Type
QFN EP
Input Frequency
>2000MHz
Operating Temperature Classification
Industrial
Max Input Freq
>2000 MHz
Propagation Delay (max)
0.45 ns @ 2.375V to 2.625V
Supply Voltage (max)
2.625 V
Supply Voltage (min)
2.375 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NB6L11SMNG
NB6L11SMNGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NB6L11SMNG
Manufacturer:
ON
Quantity:
255
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
3. JEDEC standard multilayer board − 1S2P (1 signal, 2 power) with 8 filled thermal vias under exposed pad.
Table 3. MAXIMUM RATINGS
Symbol
V
V
I
I
T
T
q
q
T
IN
OSC
A
stg
JA
JC
sol
CC
IN
Positive Power Supply
Positive Input
Input Current Through R
Output Short Circuit Current
Line−to−Line (Q to Q)
Line−to−End (Q or Q to GND)
Operating Temperature Range
Storage Temperature Range
Thermal Resistance (Junction−to−Ambient) (Note 3)
Thermal Resistance (Junction−to−Case)
Wave Solder
Table 2. ATTRIBUTES
2. For additional information, see Application Note AND8003/D.
ESD Protection
Moisture Sensitivity (Note 2)
Flammability Rating Oxygen Index: 28 to 34
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Parameter
T
(50 W Resistor)
Characteristic
Pb−Free
http://onsemi.com
Charged Device Model
Human Body Model
GND = 0 V
GND = 0 V
Static
Surge
Q or Q
Q to Q to GND
QFN−16
0 lfpm
500 lfpm
1S2P (Note 3)
3
Machine Model
Condition 1
QFN−16
V
Continuous
Continuous
QFN−16
QFN−16
QFN−16
UL 94 V−0 @ 0.125 in
IN
≤ V
Condition 2
Pb−Free Pkg
CC
> 200 V
Level 1
> 2 kV
> 1 kV
Value
225
−65 to +150
−40 to +85
Rating
41.6
35.2
265
3.8
3.8
4.0
35
70
12
24
°C/W
°C/W
°C/W
Unit
mA
mA
mA
°C
°C
°C
V
V

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