CY2DL814ZXC Cypress Semiconductor Corp, CY2DL814ZXC Datasheet - Page 7

• Manufacturer Part Number: CY2DL814ZXC
• Description: IC CLK FANOUT BUFFER 1:4 16TSSOP
• Manufacturer: Cypress Semiconductor Corp
• Series: ComLink™r
• Type: Fanout Buffer (Distribution)r

Specifications of CY2DL814ZXC

• Package / Case: 16-TSSOP
• Number Of Circuits: 1
• Ratio - Input:output: 1:4
• Differential - Input:output: Yes/Yes
• Input: LVDS, LVPECL, LVTTL
• Output: LVDS
• Frequency - Max: 400MHz
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Frequency-max: 400MHz
• Number Of Outputs: 8
• Max Input Freq: 400 MHz
• Propagation Delay (max): 4 ns
• Supply Voltage (max): 3.465 V
• Supply Voltage (min): 3.135 V
• Maximum Power Dissipation: 750 mW
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Drawing and Dimensions
ComLink is a trademark of Cypress Semiconductor Corporation. All product and company names mentioned in this document
are the trademarks of their respective holders.
Document #: 38-07057 Rev. *B
© Cypress Semiconductor Corporation, 2005. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
0.85[0.033]
0.95[0.037]
0.65[0.025]
BSC.
0.050[1.270]
BSC
8
9
16 Lead (150 Mil) SOIC
4.90[0.193]
5.10[0.200]
0.386[9.804]
0.393[9.982]
0.0138[0.350]
0.0192[0.487]
0.19[0.007]
0.30[0.012]
1
16
0.05[0.002]
0.15[0.006]
4.30[0.169]
4.50[0.177]
16-lead TSSOP 4.40 mm Body Z16.173
6.25[0.246]
6.50[0.256]
16
1
PIN 1 ID
16-Lead (150-Mil) SOIC S16.15
1.10[0.043] MAX.
0.150[3.810]
0.157[3.987]
0.004[0.102]
0.0098[0.249]
0.061[1.549]
0.068[1.727]
PIN 1 ID
SEATING
PLANE
0.076[0.003]
0.230[5.842]
0.244[6.197]
0.004[0.102]
SEATING PLANE
GAUGE
PLANE
DIMENSIONS IN MM[INCHES] MIN.
0.25[0.010]
REFERENCE JEDEC MO-153
PACKAGE WEIGHT 0.05 gms
0°~8°
Z16.173
ZZ16.173 LEAD FREE PKG.
BSC
DIMENSIONS IN INCHES[MM] MIN.
REFERENCE JEDEC MS-012
0°-8°
PACKAGE WEIGHT 0.15gms
S16.15 STANDARD PKG.
SZ16.15 LEAD FREE PKG.
STANDARD PKG.
PART #
0.016[0.406]
0.035[0.889]
0.50[0.020]
0.70[0.027]
PART #
ComLink™ Series
MAX.
0.010[0.254]
0.016[0.406]
51-85091-*A
CY2DL814
51-85068-*B
MAX.
0.0075[0.190]
0.0098[0.249]
X 45°
Page 7 of 8
0.09[[0.003]
0.20[0.008]