NB4L16MMNR2G ON Semiconductor, NB4L16MMNR2G Datasheet - Page 12
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NB4L16MMNR2G
Manufacturer Part Number
NB4L16MMNR2G
Description
IC DRVR/RCVR/BUFF/XLATOR 16-QFN
Manufacturer
ON Semiconductor
Type
Buffer/Driver, Translatorr
Datasheet
1.NB4L16MMNR2G.pdf
(12 pages)
Specifications of NB4L16MMNR2G
Number Of Circuits
1
Ratio - Input:output
2:1
Differential - Input:output
Yes/Yes
Input
CML, HSTL, LVCMOS, LVDS, LVPECL, LVTTL
Output
CML
Frequency - Max
3.5GHz
Voltage - Supply
2.375 V ~ 3.8 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-TFQFN Exposed Pad
Frequency-max
3.5GHz
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Package Type
QFN EP
Pin Count
16
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
PUBLICATION ORDERING INFORMATION
The products described herein (NB4L16M), may be covered by U.S. patents including
LITERATURE FULFILLMENT:
16 X
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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0.10 C
0.05 C
NOTE 5
16X
16X
LOCATION
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
NOTE 3
A B
DETAIL A
16X
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
b
4
1
DETAIL B
16
BOTTOM VIEW
SIDE VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
TOP VIEW
5
D2
D
13
8
(A3)
e
12
9
EXPOSED PAD
A1
e
A
B
E
E2
A
EXPOSED Cu
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
C
SEATING
PLANE
L1
http://onsemi.com
CASE 485G−01
É É É É É É
16 PIN QFN
ISSUE D
ALTERNATE TERMINAL
CONSTRUCTIONS
CONSTRUCTIONS
12
DETAIL B
MOLD CMPD
ALTERNATE
DETAIL A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L
0.575
0.022
0.128
6,362,644.
3.25
A1
É É Ç Ç Ç Ç
There may be other patents pending.
SOLDERING FOOTPRINT*
L
A3
0.012
0.30
NOTES:
0.128
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. L
3.25
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
DIM
A1
A3
D2
max
E2
L1
A
D
E
K
b
e
L
CONDITION CAN NOT VIOLATE 0.2 MM
MILLIMETERS
MIN
0.80
0.00
0.18
1.65
1.65
0.30
0.00
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.18 TYP
0.50
0.02
MAX
1.00
0.05
0.30
1.85
1.85
0.50
0.15
SCALE 10:1
EXPOSED PAD
0.059
1.50
0.012
0.30
NB4L16M/D
inches
mm