NB6L11MMNG ON Semiconductor, NB6L11MMNG Datasheet - Page 9
![IC FANOUT BUFFER DIFF CML 16-QFN](/photos/6/51/65175/16-tqfn_485g_sml.jpg)
NB6L11MMNG
Manufacturer Part Number
NB6L11MMNG
Description
IC FANOUT BUFFER DIFF CML 16-QFN
Manufacturer
ON Semiconductor
Series
ECLinPS MAX™r
Type
Fanout Buffer (Distribution)r
Datasheet
1.NB6L11MMNR2G.pdf
(9 pages)
Specifications of NB6L11MMNG
Number Of Circuits
1
Ratio - Input:output
1:2
Differential - Input:output
Yes/Yes
Input
CML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTL
Output
CML
Frequency - Max
4GHz
Voltage - Supply
2.375 V ~ 3.63 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-TFQFN Exposed Pad
Frequency-max
4GHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NB6L11MMNG
Manufacturer:
ON
Quantity:
127
PUBLICATION ORDERING INFORMATION
The products described herein (NB4L16M), may be covered by U.S. patents including
ECLinPS MAX is a trademark of Semiconductor Components Industries, LLC (SCILLC).
LITERATURE FULFILLMENT:
16 X
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Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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0.10 C
0.05 C
NOTE 5
16X
16X
LOCATION
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
NOTE 3
A B
DETAIL A
16X
Ç Ç Ç
Ç Ç Ç
Ç Ç Ç
b
4
1
DETAIL B
16
BOTTOM VIEW
SIDE VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
TOP VIEW
5
D2
D
13
8
(A3)
e
12
9
EXPOSED PAD
A1
e
A
B
E
E2
A
EXPOSED Cu
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
C
SEATING
PLANE
L1
http://onsemi.com
CASE 485G−01
É É É É É É
16 PIN QFN
ISSUE D
ALTERNATE TERMINAL
CONSTRUCTIONS
CONSTRUCTIONS
DETAIL B
MOLD CMPD
ALTERNATE
9
DETAIL A
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L
0.575
0.022
0.128
6,362,644.
3.25
A1
É É Ç Ç Ç Ç
There may be other patents pending.
SOLDERING FOOTPRINT*
L
A3
0.012
0.30
NOTES:
0.128
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. L
3.25
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
DIM
A1
A3
D2
max
E2
L1
A
D
E
K
b
e
L
CONDITION CAN NOT VIOLATE 0.2 MM
MILLIMETERS
MIN
0.80
0.00
0.18
1.65
1.65
0.30
0.00
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.18 TYP
0.50
0.02
MAX
1.00
0.05
0.30
1.85
1.85
0.50
0.15
SCALE 10:1
EXPOSED PAD
0.059
1.50
0.012
0.30
NB6L11M/D
inches
mm