MC10E111FNG ON Semiconductor, MC10E111FNG Datasheet - Page 9
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MC10E111FNG
Manufacturer Part Number
MC10E111FNG
Description
IC CLOCK DRVR ECL DFF 1:9 28PLCC
Manufacturer
ON Semiconductor
Series
10Er
Type
Fanout Buffer (Distribution)r
Datasheet
1.MC100E111FNR2G.pdf
(10 pages)
Specifications of MC10E111FNG
Number Of Circuits
1
Ratio - Input:output
1:9
Differential - Input:output
Yes/Yes
Input
ECL, PECL
Output
ECL, PECL
Frequency - Max
800MHz
Voltage - Supply
4.2 V ~ 5.7 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
28-PLCC
Frequency-max
800MHz
Number Of Outputs
18
Max Input Freq
800 MHz (Typ)
Propagation Delay (max)
0.68 ns @ 5V
Supply Voltage (max)
- 5.7 V or 5.7 V
Supply Voltage (min)
- 4.2 V or 4.2 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC10E111FNGOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC10E111FNG
Manufacturer:
ON Semiconductor
Quantity:
135
Company:
Part Number:
MC10E111FNG
Manufacturer:
ON Semiconductor
Quantity:
10 000
Part Number:
MC10E111FNG
Manufacturer:
ON/安森美
Quantity:
20 000
−L−
C
0.010 (0.250)
28
Z
G1
S
G
T
1
−N−
L−M
NOTES:
S
1. DATUMS −L−, −M−, AND −N− DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSIONS R AND U DO NOT INCLUDE
4. DIMENSIONING AND TOLERANCING PER
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMENSION H DOES NOT INCLUDE DAMBAR
V
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
MEASURED AT DATUM −T−, SEATING PLANE.
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
ANSI Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
N
A
R
S
J
E
−M−
W
VIEW S
0.007 (0.180)
Y BRK
0.007 (0.180)
D
D
PACKAGE DIMENSIONS
PLASTIC PLCC PACKAGE
−T−
0.004 (0.100)
http://onsemi.com
SEATING
PLANE
CASE 776−02
M
M
FN SUFFIX
PLCC−28
ISSUE E
T
T
L−M
L−M
9
S
S
B
Z
N
N
DIM
G1
K1
W
A
B
C
G
H
K
R
U
E
F
J
V
X
Y
Z
S
VIEW D−D
S
U
X
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
0.410
0.040
0.007 (0.180)
MIN
−−−
K
0.050 BSC
2
INCHES
_
0.007 (0.180)
0.495
0.495
0.180
0.019
0.032
0.456
0.456
0.048
0.048
0.056
0.020
0.430
0.110
MAX
VIEW S
−−−
−−−
10
−−−
_
H
12.32
12.32
10.42
M
11.43
11.43
MILLIMETERS
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
−−−
1.27 BSC
2
G1
_
T
F
M
L−M
12.57
12.57
11.58
11.58
10.92
MAX
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
−−−
−−−
10
−−−
0.007 (0.180)
T
K1
_
0.010 (0.250)
S
0.007 (0.180)
L−M
N
S
S
N
M
S
S
M
T
T
T
L−M
L−M
L−M
S
S
S
N
N
N
S
S
S