MC10H645FN ON Semiconductor, MC10H645FN Datasheet - Page 5
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MC10H645FN
Manufacturer Part Number
MC10H645FN
Description
IC CLOCK DRIVER ECL/TTL 28-PLCC
Manufacturer
ON Semiconductor
Type
Fanout Buffer (Distribution), Multiplexerr
Datasheet
1.MC10H645FNR2G.pdf
(6 pages)
Specifications of MC10H645FN
Number Of Circuits
1
Ratio - Input:output
2:9
Differential - Input:output
Yes/Yes
Input
TTL
Output
TTL
Voltage - Supply
4.75 V ~ 5.25 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
28-PLCC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Frequency-max
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC10H645FN
Manufacturer:
ON/安森美
Quantity:
20 000
Company:
Part Number:
MC10H645FNG
Manufacturer:
ON Semiconductor
Quantity:
135
Company:
Part Number:
MC10H645FNG
Manufacturer:
ON Semiconductor
Quantity:
10 000
Company:
Part Number:
MC10H645FNR2
Manufacturer:
TOS
Quantity:
20
Company:
Part Number:
MC10H645FNR2
Manufacturer:
ON Semiconductor
Quantity:
10 000
Company:
Part Number:
MC10H645FNR2G
Manufacturer:
ON Semiconductor
Quantity:
100
Company:
Part Number:
MC10H645FNR2G
Manufacturer:
ON Semiconductor
Quantity:
10 000
−L−
C
0.010 (0.250)
28
Z
G1
S
G
T
1
−N−
L−M
NOTES:
S
1. DATUMS −L−, −M−, AND −N− DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSIONS R AND U DO NOT INCLUDE
4. DIMENSIONING AND TOLERANCING PER
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMENSION H DOES NOT INCLUDE DAMBAR
V
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
MEASURED AT DATUM −T−, SEATING PLANE.
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
ANSI Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
N
A
R
S
J
E
−M−
W
VIEW S
0.007 (0.180)
Y BRK
0.007 (0.180)
D
D
PACKAGE DIMENSIONS
−T−
0.004 (0.100)
http://onsemi.com
SEATING
PLANE
M
CASE 776−02
M
FN SUFFIX
PLCC−28
ISSUE E
T
T
L−M
L−M
5
S
S
B
Z
N
N
DIM
G1
K1
W
A
B
C
G
H
K
R
U
E
F
J
V
X
Y
Z
S
VIEW D−D
S
U
X
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
0.410
0.040
0.007 (0.180)
MIN
−−−
K
0.050 BSC
2
INCHES
_
0.007 (0.180)
0.495
0.495
0.180
0.019
0.032
0.456
0.456
0.048
0.048
0.056
0.020
0.430
0.110
MAX
VIEW S
−−−
−−−
10
−−−
_
H
M
12.32
12.32
10.42
11.43
11.43
MILLIMETERS
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
−−−
1.27 BSC
2
G1
_
T
F
M
L−M
12.57
12.57
11.58
11.58
10.92
MAX
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
−−−
−−−
10
−−−
0.007 (0.180)
T
K1
_
S
0.010 (0.250)
0.007 (0.180)
L−M
N
S
S
N
M
S
S
M
T
T
T
L−M
L−M
L−M
S
S
S
N
N
N
S
S
S