ICS502M IDT, Integrated Device Technology Inc, ICS502M Datasheet - Page 3

• Manufacturer Part Number: ICS502M
• Description: IC PLL CLK MULTIPLIER 8-SOIC
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: LOCO™r
• Type: Clock Generatorr

Specifications of ICS502M

• Pll: Yes
• Input: Clock, Crystal
• Output: CMOS
• Number Of Circuits: 1
• Ratio - Input:output: 2:1
• Differential - Input:output: No/No
• Frequency - Max: 190MHz
• Divider/multiplier: No/Yes
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC
• Frequency-max: 190MHz
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 502M

External Components
Decoupling Capacitor
As with any high-performance mixed-signal IC, the ICS502
must be isolated from system power supply noise to perform
optimally.
A decoupling capacitor of 0.01µF must be connected
between VDD and GND. It must be connected close to the
ICS502 to minimize lead inductance. No external power
supply filtering is required for the ICS502.
Series Termination Resistor
A 33 Ω terminating resistor can be used next to the CLK pin.
The total on-chip capacitance is approximately 12 pF. A
parallel resonant, fundamental mode crystal should be
used.
Absolute Maximum Ratings
Recommended Operation Conditions
IDT™ / ICS™ LOCO™ PLL CLOCK MULTIPLIER
ICS502
LOCO™ PLL CLOCK MULTIPLIER
Stresses above the ratings listed below can cause permanent damage to the ICS502. These ratings, which are
standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical
parameters are guaranteed only over the recommended operating temperature range.
Supply Voltage, VDD
All Inputs and Outputs
Ambient Operating Temperature (industrial)
Ambient Operating Temperature (commercial)
Storage Temperature
Soldering Temperature
Parameter
Ambient Operating Temperature (commercial)
Ambient Operating Temperature (industrial)
Power Supply Voltage (measured in respect to GND)
Item
3
Crystal Load Capacitors
The device crystal connections should include pads for
small capacitors from X1 to ground and from X2 to ground.
These capacitors are used to adjust the stray capacitance of
the board to match the nominally required crystal load
capacitance. Because load capacitance can only be
increased in this trimming process, it is important to keep
stray capacitance to a minimum by using very short PCB
traces (and no vias) between the crystal and device. Crystal
capacitors, if needed, must be connected from each of the
pins X1 and X2 to ground.
The value (in pF) of these crystal caps should equal (C
pF)*2. In this equation, C
Example: For a crystal with a 16 pF load capacitance, each
crystal capacitor would be 8 pF [(16-12) x 2] = 8.
Min.
-40
+3
0
7 V
-0.5 V to VDD+0.5 V
-40 to +85 ° C
0 to +70 ° C
-65 to +150 ° C
260 ° C
Typ.
–
–
Rating
L
= crystal load capacitance in pF.
Max.
+5.5
+70
+85
ICS502
CLOCK MULTIPLIER
Units
° C
° C
V
REV M 051310
L
-12