ICS501AMI IDT, Integrated Device Technology Inc, ICS501AMI Datasheet - Page 3

• Manufacturer Part Number: ICS501AMI
• Description: IC PLL CLK MULTIPLIER 8-SOIC
• Manufacturer: IDT, Integrated Device Technology Inc
• Series: LOCO™r
• Type: Clock Generatorr

Specifications of ICS501AMI

• Pll: Yes
• Input: Clock, Crystal
• Output: CMOS
• Number Of Circuits: 1
• Ratio - Input:output: 1:1
• Differential - Input:output: No/No
• Frequency - Max: 166MHz
• Divider/multiplier: No/Yes
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC
• Frequency-max: 166MHz
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 501AMI

IDT® LOCO™ PLL CLOCK MULTIPLIER
ICS501A
LOCO™ PLL CLOCK MULTIPLIER
External Components
Decoupling Capacitor
As with any high-performance mixed-signal IC, the
ICS501A must be isolated from system power supply
noise to perform optimally.
A decoupling capacitor of 0.01µF must be connected
between VDD and the GND. It must be connected close
to the ICS501A to minimize lead inductance. No
external power supply filtering is required for the
ICS501A.
Series Termination Resistor
A 33 terminating resistor can be used next to the CLK
pin for trace lengths over one inch.
Crystal Load Capacitors
The total on-chip capacitance is approximately 12 pF. A
Absolute Maximum Ratings
Recommended Operation Conditions
Stresses above the ratings listed below can cause permanent damage to the ICS501A. These ratings,
which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of
the device at these or any other conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can
affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.
Supply Voltage, VDD
All Inputs and Outputs
Ambient Operating Temperature
Storage Temperature
Soldering Temperature
Parameter
Ambient Operating Temperature
Power Supply Voltage (measured in respect to GND)
Item
3
parallel resonant, fundamental mode crystal should be
used. The device crystal connections should include
pads for small capacitors from X1 to ground and from
X2 to ground. These capacitors are used to adjust the
stray capacitance of the board to match the nominally
required crystal load capacitance. Because load
capacitance can only be increased in this trimming
process, it is important to keep stray capacitance to a
minimum by using very short PCB traces (and no vias)
between the crystal and device. Crystal capacitors, if
needed, must be connected from each of the pins X1
and X2 to ground.
The value (in pF) of these crystal caps should equal (C
-12 pF)*2. In this equation, C
in pF. Example: For a crystal with a 16 pF load
capacitance, each crystal capacitor would be 8 pF
[(16-12) x 2 = 8].
Min.
+3.0
0
7 V
-0.5 V to VDD+0.5 V
-40 to +85 C
-65 to +150 C
260 C
Typ.
L
Rating
= crystal load capacitance
Max.
+3.6
+70
ICS501A
CLOCK MULTIPLIER
Units
REV G 121410
V
C
L