1-1565692-1 TE Connectivity, 1-1565692-1 Datasheet - Page 5
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1-1565692-1
Manufacturer Part Number
1-1565692-1
Description
SEMI-HARD TRAY DDR SODIMM SOCK
Manufacturer
TE Connectivity
Specifications of 1-1565692-1
Socket Style
SO DIMM
Dram Type
Double Data Rate (DDR)
Pcb Mount Style
Surface Mount
Module Orientation
Right Angle
Profile
Low
Keying
Reverse
Dram Voltage
2.5 V
Solder Tail Contact Plating
Gold Flash
Socket Type
Memory Card
Number Of Positions
200
Row-to-row Spacing (mm [in])
5.60 [0.220]
Centerline (mm [in])
0.60 [0.024]
Number Of Rows
Dual
Ejector Type
Locking
Ejector Location
Both Ends
Number Of Keys
1
Latch Material
Stainless Steel
Latch Plating
Tin
Boss
Without
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold Flash
Contact Base Material
Copper Alloy
Housing Material
High Temperature Thermoplastic
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Stack Height (mm [in])
4.00 [0.157]
Insertion Style
Cam-In
Center Key (mm [in])
None
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Converted to comply with RoHS directive
Application Type
DDR SDRAM
Packaging Method
Semi-Hard Tray Assembly
Packaging Quantity
20
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
1-1565692-1
Manufacturer:
TYCO
Quantity:
36 922
Rev. F
260 Max.
230 Min.
Soldering temperature ( =Ä )
180
300
250
200
150
100
50
Fig.3-1 Termination Resistance Mesuring Points.
Fig.4 Temperature Profile of Reflow Soldering
Pre-Heating
90 30 sec
Product Specification
+ -
Peak temperature
260=˜ Max.
30 10 sec
Heat
+ -
108-5701
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