1-1740194-2 TE Connectivity, 1-1740194-2 Datasheet - Page 4

• Manufacturer Part Number: 1-1740194-2
• Description: 9P HD20 RECEP. HDR UNC4-40 EUROST. SMT
• Manufacturer: TE Connectivity
• Series: AMPLIMITE HD-20r
• Type: D-Subminiaturer

Specifications of 1-1740194-2

• Connector Type: D Sub
• No. Of Contacts: 9
• D Sub Shell Size: DA
• Connector Body Material: Metal
• Gender: Receptacle
• Contact Termination: Solder
• Length/height, External: 12.5mm
• Rohs Compliant: Yes
• Pitch: 2.74 mm
• Termination Method: Solder
• Mounting: Surface Mount
• Body Orientation: Right Angle
• Pcb Mounting Orientation: Right Angle
• Product Series: HD 20
• Mating Connector Lock: With
• Mating Connector Lock Type: Threaded Insert, 4-40 UNC
• Pcb Mount Retention: With
• Shell Type: Front Metal Shell
• Shell Size: 1
• Footprint (mm [in]): 7 [.276]
• Grounding Indents: Without
• Grounding Straps: With
• Pcb Mount Style: Surface Mount
• Color Code: None
• Sealed: No
• Profile: Eurostyle - 3.6 mm Installation Height
• Color: Black
• Shell Material: Steel
• Panel Mount Retention: Without
• Grounding Clips: Without
• Solder Tail Contact Plating: Tin over Nickel
• Number Of Positions: 9
• Pcb Mount Retention Type: Boardlock(s)
• Shell Plating: Tin
• Contact Plating, Mating Area, Material: Gold (30)
• Contact Base Material: CuMg
• Connector Style: Receptacle
• Ul Flammability Rating: UL 94V-0
• Housing Material: PCT - GF
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant

3.6.
NOTE
Qualifikations- und Requalifikationsprüfungen
Temperature life.
Mixed flowing gas.
Component heat resistance to
lead-free reflow soldering.
Solderability, lead - free
NOTE
Examination of product
Termination resistance, dry circuit
Insulation resistance
Dielectric withstanding voltage
Temperature rise vs current
Solderability
Vibration
Physical shock
Durability
Mating force
Unmating force
Thermal shock
Humidity-temperature cycling
Temperature life
Mixed flowing gas
Component heat resistance
Shall meet visual requirements, show no physical damage and shall meet requirements of
additional tests as specified in Test Sequence in Figure 2.
Test or Examination
(a) See paragraph 4.4.A.
(b) Numbers indicate sequence in which tests are performed.
Figure 1 (end)
See note.
See Note
No damage or shrinkage
Solderable area shall have a
minimum of 95% solder coverage
Solderability / Heat resistance
1,9
3,7
1
5
6
4
2
8
4 of 10
1,6
2,5
2
3
4
Figure 2
1,6
2,5
3
3
4
Test Sequence (b)
1,3
Test Group (a)
4
2
1,5
2,4
5
3
1,8
2,6
3,7
6
4
5
IEC 60068 – 2 – 2, Ba
Subject mated connectors to
temperature life at 105°C for
500 hours.
IEC 60068 – 2 -60, Ke / 4
Subject mated connectors to
environmental class III for 20
days. Precondition connectors
with 10 durability cycles.
60068 – 2 – 20, Ta
(Tyco spec. 109-201 / B )
1,3
7
2
1,5
8
3
2
4
108-94000
1,3
9
2