DS1339U-3+ Maxim Integrated Products, DS1339U-3+ Datasheet - Page 2

• Manufacturer Part Number: DS1339U-3+
• Description: IC RTC I2C W/ALARM 8-USOP
• Manufacturer: Maxim Integrated Products
• Type: Clock/Calendar/Alarmr

Specifications of DS1339U-3+

• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 3.3 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Function: Clock/Calendar/Alarm/Trickle Charger
• Supply Voltage (max): 3.3 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Rtc Bus Interface: Serial (I2C)
• Supply Current: 450 uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground………………………………………………………………-0.3V to +6.0V
Operating Temperature Range (Noncondensing)………………………………………………………….-40°C to +85°C
Storage Temperature Range………………………………………………………………………………..-55°C to +125°C
Lead Temperature (soldering, 10s)...…………………………………………………………………………………+260°C
Soldering Temperature (reflow).……………………………………………………………………………………….+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is
not implied. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
µSOP
SO
RECOMMENDED DC OPERATING CONDITIONS
(T
Note 1:
Supply Voltage
Backup Supply Voltage
Logic 1
Logic 0
Power-Fail Voltage
A
= -40°C to +85°C) (Note 2)
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
SYMBOL
V
BACKUP
V
V
V
V
CC
JC
JC
PF
IH
IL
)……………………………………………………………………42°C/W
)……………………………………………………………………23°C/W
JA
JA
).…………………...……………………………………….206.3°C/W
).……………………………………………………………….73°C/W
DS1339-2
DS1339-3
DS1339-33
DS1339-2
DS1339-3
DS1339-33
2 of 20
CONDITIONS
0.7 x
2.97
1.58
2.45
2.70
MIN
-0.3
V
1.8
2.7
1.3
DS1339 I
CC
TYP
1.70
2.59
2.85
2
2.0
3.0
3.3
3.0
C Serial Real-Time Clock
+0.3 x
V
MAX
1.80
2.70
2.97
V
5.5
5.5
5.5
3.7
0.3
CC
CC
+
UNITS
V
V
V
V
V