1717833-1 TE Connectivity, 1717833-1 Datasheet - Page 3
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1717833-1
Manufacturer Part Number
1717833-1
Description
SEMI-HARD TRAY DDR SODIMM 4H RVS LATCH D
Manufacturer
TE Connectivity
Specifications of 1717833-1
Socket Style
SO DIMM
Dram Type
Double Data Rate (DDR)
Pcb Mount Style
Surface Mount
Module Orientation
Right Angle
Profile
Low
Keying
Reverse
Dram Voltage
2.5 V
Solder Tail Contact Plating
Gold Flash
Socket Type
Memory Card
Number Of Positions
200
Row-to-row Spacing (mm [in])
5.60 [0.220]
Centerline (mm [in])
0.60 [0.024]
Number Of Rows
Dual
Ejector Type
Locking
Ejector Location
Both Ends
Number Of Keys
1
Latch Material
Stainless Steel
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold Flash
Contact Base Material
Copper Alloy
Housing Material
High Temperature Thermoplastic
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Stack Height (mm [in])
4.60 [0.180]
Insertion Style
Cam-In
Center Key (mm [in])
None
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Always was RoHS compliant
Application Type
DDR SDRAM
Packaging Method
Tray
Packaging Quantity
20 Pieces/Tray
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
1717833-1
Manufacturer:
TYCO
Quantity:
36 796
3.5.6
3.5.7
Para.
3.5.8
3.5.9
3.5.10
3.5.11
Para.
3.5.12
3.5.13
3.5.14
Rev. F
Physical Shock
P.C.Board Mating Force
Test Items
Durability
(Repeated
Mate/Unmating)
Solder ability
Resistance to Reflow
Soldering Heat
Thermal Shock
Test Items
Humidity-Temperature
Cycling
Salt Spray
Industrial Gas (SO2)
No electrical discontinuity
greater than 0.1 sec. shall
occur.
∆R=20 m Æ Max. (Final)
200 Pos. : 59.8N (6.1 kgf) Max.
Requirements
∆R=20 m Æ Max. (Final)
Wet Solder Coverage :
95 % Min.
No physical damage shall
occur
∆R=20 m Æ Max. (Final)
∆ 4
∆ 4
∆ 4
4 G S W K T G O G P V U
+ P U W N C V K Q P T G U K U V C P E G
Environmental Requirements
Product Specification
O Æ / C Z
O Æ / C Z
O Æ / C Z
/ Æ / K P H K P C N
( K P C N
( K P C N
( K P C N
Accelerated Velocity : 490 m/s
Waveform
Duration : 11 m sec.
Number of Drops: 3 drops each to normal
and reversed directions of X, Y and Z
axes, totally 18 drops.
AMP Spec. 109-5208
Condition A
Operation Speed : 100 mm/min.
Measure the force required to mate
connectors.(In this test, the force required
to turn PCB before it engages on lacking,
is excluded.)
AMP Spec. 109-5206
Procedures
Repeated insertion and extraction of P.C.B
to and from the connector with the turns to
lock it and then unlock it for 25 cycles.
Solder Temperature : 245 r 5 ° C
Immersion Duration : 5 r 0.5 seconds
Flux : Alpha 100
AMP Spec. 109-5203
Test connector on P.C.Board
Mated connector
9 55°C / 30 min.,
85° C / 30 min.
Making this a cycle, repeat 5 cycles.
AMP Spec. 109-5103 Condition A
Procedures
Mated connector, 25:* 65°C,
90:* 95 % R. H. 5 cycles
Cold shock 9 10° C performed
AMP Spec. 109-5106
Subject mated connectors to 5 % salt
concentration for 24 hours :
AMP Spec. 109-5101
Mated connector
SO2 Gas : 10 ppm, 95 % R. H.
25° C, 24 hours
AMP Spec. 109-5107
Pre-Heat150:* 180 ‘ :90 r 30sec.
Heat 230 ‘ Min.
Heat Peak260 ‘ Max. See Fig.4-2
OR
Apply to JEDEC standard
(J-STD-020C)
: Half sine
Condition B
:30 r 10sec.
Condition A
Condition A
2
108-5701
(50 G)
3 of 5