2-487952-8 TE Connectivity, 2-487952-8 Datasheet - Page 4

• Manufacturer Part Number: 2-487952-8
• Description: 028 1MM FPC BTM HORZ
• Manufacturer: TE Connectivity

Specifications of 2-487952-8

• Termination Method To Pc Board: Surface Mount
• Pcb Mounting Orientation: Right Angle
• Pcb Mount Alignment: Without
• Pcb Mount Retention: With
• Actuator Type: Stuffer
• Shrouded: Yes
• Sealed: No
• Strain Relief: Without
• Contact Current Rating, Max (a): 1
• Operating Voltage Reference: AC
• Operating Voltage (vac): 200
• Shielded: No
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 2.56 [0.1008]
• Centerline (mm [in]): 1.00 [0.039]
• Number Of Positions: 28
• Selectively Loaded: No
• Pcb Mount Retention Type: Solder Pads
• Length (x-axis) (mm [in]): 35.92 [1.4142]
• Width (z-axis) (mm [in]): 6.54 [0.2575]
• Contact Plating, Mating Area, Material: Tin-Lead
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.381 [15]
• Tail Plating Material: Tin-Lead
• Tail Plating, Thickness (µm [?in]): 0.381 [15]
• Contact Design: Single Beam
• Housing Material: Liquid Crystal Polymer (LCP)
• Contact Mating Location: Bottom
• Flex Cable Thickness (mm [in]): 0.3 [0.012]
• Housing Color: Ivory
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Circuit Identification Feature: With
• Operating Temperature (°c [°f]): -40 – +85 [-40 – +185]
• Zif/non-zif: ZIF
• Contact Transmits (typical Application): Signal (Data)
• Pick And Place Cover: Without
• Packaging Method: Tape & Reel

4.
4.1.
4.2.
4.3.
4.4.
Rev C
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. When
product failure occurs, corrective action shall be taken and samples resubmitted for qualification.
Testing to confirm corrective action is required before resubmittal.
Quality Conformance Inspection
The applicable quality inspection plan will specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Sample Selection
Samples shall be prepared in accordance with applicable Instruction Sheets and shall be selected
at random from current production. All test groups shall consist of a minimum of 5 connectors.
Test groups 1 and 2 shall be soldered to printed circuit boards. A minimum of 30 contacts from
these test groups shall be randomly selected and tested. If available, test group 1 shall contain
both minimum and maximum size connectors. Test groups 3 and 4 shall consist of a minimum of 5
unmated and unmounted connectors. A minimum of 24 contacts from test group 3 shall be
randomly selected and tested.
Test Sequence
Qualification inspection shall be verified by testing samples as specified in Figure 2.
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