LTC1864CMS8#PBF Linear Technology, LTC1864CMS8#PBF Datasheet - Page 22

IC A/D CONV 1CH 16BIT 8-MSOP

LTC1864CMS8#PBF

Manufacturer Part Number
LTC1864CMS8#PBF
Description
IC A/D CONV 1CH 16BIT 8-MSOP
Manufacturer
Linear Technology
Datasheet

Specifications of LTC1864CMS8#PBF

Number Of Bits
16
Sampling Rate (per Second)
250k
Data Interface
MICROWIRE™, Serial, SPI™
Number Of Converters
1
Power Dissipation (max)
400mW
Voltage Supply Source
Single Supply
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
LTC1864/LTC1865
PACKAGE DESCRIPTION
22
(.0120 ± .0015)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.305 ± 0.038
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
TYP
(.206)
5.23
MIN
RECOMMENDED SOLDER PAD LAYOUT
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.2 – 3.45
(.0197)
0.50
BSC
GAUGE PLANE
(.007)
0.18
(Reference LTC DWG # 05-08-1661)
10-Lead Plastic MSOP
0.254
(.010)
MS Package
DETAIL “A”
DETAIL “A”
0° – 6° TYP
(.021 ± .006)
0.53 ± 0.01
SEATING
PLANE
(.118 ± .004)
3.00 ± 0.102
(.007 – .011)
(.192 ± .004)
0.17 – 0.27
(NOTE 3)
4.88 ± 0.10
(.043)
MAX
1.10
(.0197)
0.50
10
TYP
1 2 3 4 5
9
8
7 6
(.118 ± .004)
3.00 ± 0.102
(.0196 ± .003)
0.497 ± 0.076
(.034)
0.86
NOTE 4
REF
(.005 ± .002)
0.13 ± 0.05
MSOP (MS) 1001
REF
18645fb

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