AD7911ARMZ Analog Devices Inc, AD7911ARMZ Datasheet - Page 24

IC ADC 10BIT DUAL 2CH 8-MSOP

AD7911ARMZ

Manufacturer Part Number
AD7911ARMZ
Description
IC ADC 10BIT DUAL 2CH 8-MSOP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD7911ARMZ

Data Interface
DSP, MICROWIRE™, QSPI™, Serial, SPI™
Operating Temperature
-40°C ~ 85°C
Number Of Bits
10
Sampling Rate (per Second)
250k
Number Of Converters
1
Power Dissipation (max)
20mW
Voltage Supply Source
Single Supply
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Resolution (bits)
10bit
Input Channel Type
Single Ended
Supply Voltage Range - Analogue
2.35V To 5.25V
Supply Current
4mA
No. Of Pins
8
Sampling Rate
250kSPS
Rohs Compliant
Yes
Number Of Elements
1
Resolution
10Bit
Architecture
SAR
Sample Rate
250KSPS
Input Polarity
Unipolar
Input Type
Voltage
Rated Input Volt
5.25V
Differential Input
No
Power Supply Requirement
Single
Single Supply Voltage (typ)
3/5V
Single Supply Voltage (min)
2.35V
Single Supply Voltage (max)
5.25V
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Power Dissipation
20mW
Differential Linearity Error
±0.5LSB
Integral Nonlinearity Error
±0.5LSB
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
8
Package Type
MSOP
Input Signal Type
Single-Ended
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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AD7911/AD7921
APPLICATION HINTS
GROUNDING AND LAYOUT
The printed circuit board that houses the AD7911/AD7921
should be designed such that the analog and digital sections are
separated and confined to certain areas of the board. This
facilitates the use of ground planes that can be separated easily.
A minimum etch technique is generally best for ground planes,
because it gives the best shielding. Digital and analog ground
planes should be joined at only one place. If the AD7911/
AD7921 is in a system where multiple devices require an
AGND-to-DGND connection, the connection should still be
made at one point only, a star ground point that should be
established as close as possible to the AD7911/AD7921.
Avoid running digital lines under the device, because these
couple noise onto the die. The analog ground plane should be
allowed to run under the AD7911/AD7921 to avoid noise
coupling. The power supply lines to the AD7911/AD7921
should use as large a trace as possible to provide low impedance
paths and reduce the effects of glitches on the power supply line.
Fast-switching signals like clocks should be shielded with digital
Rev. 0 | Page 24 of 28
ground to avoid radiating noise to other sections of the board,
and clock signals should never be run near the analog inputs.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other to
reduce the effects of feedthrough through the board. A micro-
strip technique is by far the best, but is not always possible with
a double-sided board. In this technique, the component side of
the board is dedicated to ground planes, while signals are placed
on the solder side.
Good decoupling is also very important. The analog supply
should be decoupled with 10 µF tantalum in parallel with 0.1 µF
capacitors to AGND. To achieve the best performance from
these decoupling components, the user should endeavor to keep
the distance between the decoupling capacitor and the V
GND pins to a minimum with short track lengths connecting
the respective pins.
DD
and

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