AD9235BCP-65 Analog Devices Inc, AD9235BCP-65 Datasheet - Page 37

• Manufacturer Part Number: AD9235BCP-65
• Description: IC ADC 12BIT 65MSPS 32-LFCSP
• Manufacturer: Analog Devices Inc

Specifications of AD9235BCP-65

• Rohs Status: RoHS non-compliant
• Number Of Bits: 12
• Sampling Rate (per Second): 65M
• Data Interface: Parallel
• Number Of Converters: 3
• Power Dissipation (max): 300mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN, CSP Exposed Pad

ORDERING GUIDE
Model
AD9235BRU-20
AD9235BRURL7-20
AD9235BRUZ-20
AD9235BRUZRL7-20
AD9235BRU-40
AD9235BRURL7-40
AD9235BRUZ-40
AD9235BRUZRL7-40
AD9235BRU-65
AD9235BRURL7-65
AD9235BRUZ-65
AD9235BRUZRL7-65
AD9235BCP-20
AD9235BCPRL7-20
AD9235BCPZ-20
AD9235BCPZRL7-20
AD9235BCP-40
AD9235BCPRL7-40
AD9235BCPZ-40
AD9235BCPZRL7-40
AD9235BCP-65
AD9235BCPRL7-65
AD9235BCPZ-65
AD9235BCPZRL7-65
AD9235-20PCB
AD9235-40PCB
AD9235-65PCB
AD9235BCP-20EB
AD9235BCP-40EB
AD9235BCP-65EB
1
2
Z = Pb-free part.
It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of
the package is achieved with exposed paddle soldered to the customer board.
2
2
2
1, 2
1, 2
1, 2
1
1
1
2
2
2
1, 2
1, 2
1, 2
1
1
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
32-Lead Lead Frame Chip Scale Package (LFCSP)
TSSOP Evaluation Board
TSSOP Evaluation Board
TSSOP Evaluation Board
LFCSP Evaluation Board
LFCSP Evaluation Board
LFCSP Evaluation Board
Rev. C | Page 37 of 40
Package Option
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
RU-28
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
CP-32-2
AD9235