AD9222BCPZ-50 Analog Devices Inc, AD9222BCPZ-50 Datasheet - Page 9

IC ADC 12BIT 8CH 50MSPS 64LFCSP

AD9222BCPZ-50

Manufacturer Part Number
AD9222BCPZ-50
Description
IC ADC 12BIT 8CH 50MSPS 64LFCSP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD9222BCPZ-50

Data Interface
Serial, SPI™
Number Of Bits
12
Sampling Rate (per Second)
50M
Number Of Converters
8
Power Dissipation (max)
760mW
Voltage Supply Source
Analog and Digital
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-LFCSP
Resolution (bits)
12bit
Sampling Rate
50MSPS
Input Channel Type
Differential
Supply Voltage Range - Analog
1.7V To 1.9V
Supply Voltage Range - Digital
1.7V To 1.9V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AD9222-65EBZ - BOARD EVALUATION AD9222 65MSPSAD9222-50EBZ - BOARD EVALUATION FOR AD9222
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD9222BCPZ-50
Manufacturer:
AD
Quantity:
1 001
Part Number:
AD9222BCPZ-50
Manufacturer:
ADI
Quantity:
280
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
ELECTRICAL
ENVIRONMENTAL
AVDD
DRVDD
AGND
AVDD
Digital Outputs
CLK+, CLK−
VIN + x, VIN − x
SDIO/ODM
PDWN, SCLK/DTP, CSB
REFT, REFB, RBIAS
VREF, SENSE
Operating Temperature
Maximum Junction
Lead Temperature
Storage Temperature
(D + x, D − x, DCO+,
DCO−, FCO+, FCO−)
Range (Ambient)
Temperature
(Soldering, 10 sec)
Range (Ambient)
DRGND
DRGND
AGND
AGND
AGND
With
Respect To
AGND
DRVDD
DRGND
AGND
AGND
AGND
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−40°C to +85°C
150°C
300°C
−65°C to +150°C
Rev. D | Page 9 of 60
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL IMPEDANCE
Table 6.
Air Flow
Velocity (m/s)
0.0
1.0
2.5
1
ESD CAUTION
θ
soldered to PCB.
JA
for a 4-layer PCB with solid ground plane (simulated). Exposed pad
θ
17.7°C/W
15.5°C/W
13.9°C/W
JA
1
θ
8.7°C/W
JB
θ
0.6°C/W
AD9222
JC

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