AD5232BRU50 Analog Devices Inc, AD5232BRU50 Datasheet - Page 7

• Manufacturer Part Number: AD5232BRU50
• Description: IC DGTL POT DUAL 256POS 16-TSSOP
• Manufacturer: Analog Devices Inc

Specifications of AD5232BRU50

• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Rohs Status: RoHS non-compliant
• Taps: 256
• Resistance (ohms): 50K
• Number Of Circuits: 2
• Temperature Coefficient: 600 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: 4-Wire SPI Serial
• Voltage - Supply: 2.7 V ~ 5.5 V, ±2.25 V ~ 2.75 V
• Operating Temperature: -40°C ~ 85°C
• Resistance In Ohms: 50K
• Peak Reflow Compatible (260 C): No
• Supply Voltage Max: 5.5V
• Leaded Process Compatible: No
• Supply Voltage Min: 2.7V
• Wiper Type: Non-Volatile
• For Use With: EVAL-AD5232-10EBZ - BOARD EVALUATION FOR AD5232-10
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

ABSOLUTE MAXIMUM RATINGS
T
Table 3.
Parameter
V
V
V
V
A
Digital Inputs and Output Voltage to GND
Operating Temperature Range
Maximum Junction Temperature (T
Storage Temperature Range
Lead Temperature, Soldering
Package Power Dissipation
1
2
Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
Includes programming of nonvolatile memory.
DD
SS
DD
A
A
X
, V
Intermittent
Continuous
Vapor Phase (60 sec)
Infrared (15 sec)
− B
= 25°C, unless otherwise noted.
to GND
to GND
to V
B
, V
X
, A
W
SS
to GND
X
− W
X
1
, B
X
− W
X
2
J
max)
Rating
+0.3 V, −7 V
7 V
±20 mA
±2 mA
−0.3 V, V
−40°C to +85°C
150°C
−65°C to +150°C
220°C
(T
−0.3 V, +7 V
V
215°C
SS
J
− 0.3 V, V
max − T
DD
+ 0.3 V
A
DD
)/θ
+ 0.3 V
JA
Rev. A | Page 7 of 24
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
16-Lead TSSOP (RU-16)
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
150
JA
θ
28
JC
AD5232
Unit
°C/W