ADV7611BSWZ Analog Devices Inc, ADV7611BSWZ Datasheet - Page 8

• Manufacturer Part Number: ADV7611BSWZ
• Description: 1 INPUT LOW POWER STAND ALONE HDMI 1.4RX
• Manufacturer: Analog Devices Inc

Specifications of ADV7611BSWZ

• Number Of Transmitters: Not Required
• Power Supply Requirement: Single
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): Not RequiredV
• Lead Free Status / Rohs Status: Compliant

ADV7611
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
DVDD to GND
PVDD to GND
DVDDIO to GND
CVDD to GND
TVDD to GND
Digital Inputs Voltage to GND
5 V Tolerant Digital Inputs to
Digital Outputs Voltage to GND
XTALP, XTALN
SCL/SDA Data Pins to DVDDIO
Maximum Junction Temperature
Storage Temperature Range
Infrared Reflow Soldering (20 sec)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL and
DDCA_SDA.
GND
(T
J MAX
1
)
Rating
2.2 V
2.2 V
4.0 V
2.2 V
4.0 V
GND − 0.3 V to DVDDIO + 0.3 V
5.3 V
GND − 0.3 V to DVDDIO + 0.3 V
GND − 0.3 V to PVDD + 0.3 V
DVDDIO − 0.3 V to DVDDIO +
3.6 V
125°C
−60°C to +150°C
260°C
Rev. 0 | Page 8 of 16
PACKAGE THERMAL PERFORMANCE
To reduce power consumption when using the ADV7611, the
user is advised to turn off the unused sections of the part.
Due to the printed circuit board (PCB) metal variation, and,
therefore, variation in PCB heat conductivity, the value of θ
may differ for various PCBs.
The most efficient measurement solution is obtained using the
package surface temperature to estimate the die temperature
because this eliminates the variance associated with the θ
The maximum junction temperature (T
exceeded. The following equation calculates the junction tempera-
ture using the measured package surface temperature and applies
only when no heat sink is used on the device under test (DUT):
where:
T
Ψ
W
I
where 0.05 is 5% of the TVDD power that is dissipated on the
part itself.
ESD CAUTION
CVDD
S
JT
TOTAL
is the package surface temperature (°C).
= 0.4°C/W for the 64-lead LQFP_EP.
T
) + (DVDD × I
J
= ((PVDD × I

T
S


Ψ
JT

DVDD
W
PVDD
TOTAL
) + (DVDDIO × I
) + (0.05 × TVDD × I

J MAX
) of 125°C must not be
DVDDIO
TVDD
))
) + (CVDD ×
JA
value.
JA