AD5280BRU200 Analog Devices Inc, AD5280BRU200 Datasheet - Page 5

• Manufacturer Part Number: AD5280BRU200
• Description: IC DGTL POT 200K 256POS 14-TSSOP
• Manufacturer: Analog Devices Inc

Specifications of AD5280BRU200

• Rohs Status: RoHS non-compliant
• Taps: 256
• Resistance (ohms): 200K
• Number Of Circuits: 1
• Temperature Coefficient: 30 ppm/°C Typical
• Memory Type: Volatile
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 4.5 V ~ 16.5 V, ±4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-TSSOP
• Resistance In Ohms: 200K
• Number Of Elements: 1
• # Of Taps: 256
• Resistance (max): 200KOhm
• Power Supply Requirement: Single/Dual
• Interface Type: Serial (2-Wire/I2C)
• Single Supply Voltage (typ): 15V
• Dual Supply Voltage (typ): ±5V
• Single Supply Voltage (min): 4.5V
• Single Supply Voltage (max): 16.5V
• Dual Supply Voltage (min): ±4.5V
• Dual Supply Voltage (max): ±5.5V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 14
• Lead Free Status / RoHS Status: Not Compliant

ABSOLUTE MAXIMUM RATINGS
T
Table 2.
Parameter
V
V
V
V
A
V
Output Voltage to GND
Operating Temperature Range
Maximum Junction Temperature (T
Storage Temperature Range
Reflow Soldering
1
Maximum terminal current is bound by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
DD
SS
DD
A
LOGIC
A
X
, V
Intermittent
Continuous
Peak Temperature
Time at Peak Temperature
to B
= 25°C, unless otherwise noted.
to GND
to GND
to V
B
, V
to GND
X
W
, A
SS
to GND
X
to W
1
X
, B
X
to W
X
JMAX
)
Rating
−0.3 V to +16.5 V
0 V to −7 V
16.5 V
V
±20 mA
±5 mA
0 V to 7 V
0 V to 7 V
−40°C to +85°C
150°C
−65°C to +150°C
260°C
20 sec to 40 sec
SS
to V
DD
Rev. C | Page 5 of 28
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages. Package
power dissipation = (T
Table 3. Thermal Resistance
Package Type
TSSOP-14
TSSOP-16
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
JMAX
− T
A
)/ θ
JA .
θ
206
150
AD5280/AD5282
JA
Unit
°C/W
°C/W