641644-2 TE Connectivity, 641644-2 Datasheet - Page 5

• Manufacturer Part Number: 641644-2
• Description: CONTACT, SOCKET, 24AWG, IDC / IDT
• Manufacturer: TE Connectivity
• Series: MTA-100r

Specifications of 641644-2

• Connector Type: Wire To Board Contact
• Contact Plating: Tin
• Contact Material: Phosphor Bronze
• Contact Termination: IDC / IDT
• Wire Size (awg): 24
• Rohs Compliant: Yes
• Contact Gender: Socket
• Termination Method To Wire/cable: IDC LED
• Wire Size (mm² [awg]): 0.2² [24]
• Used For: MTA-100 Connectors
• Contact Configuration: Replacement Contacts
• Contact Plating, Mating Area, Material: Tin
• Contact Base Material: Phosphor Bronze
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Packaging Method: Loose Piece
• For Use With: MTA-100 Connectors

4.
4.1.
4.2.
4.3.
4.4.
Rev H
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product meets requirements of Figure 1. Failures attributed
to equipment, test setup or operator deficiencies shall not disqualify product. When product failure
occurs, corrective action shall be taken and samples resubmitted for qualification. Testing to confirm
corrective action is required before resubmittal.
Quality Conformance Inspection
The applicable quality inspection plan will specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Sample Selection
Samples shall be prepared in accordance with applicable Instruction Sheets and shall be selected
at random from current production. Test group 1 shall consist of 5, 6 position standard tin-lead
plated samples and 5, 6 position gold plated samples. All samples shall be terminated to the
maximum wire size and mounted on printed circuit board PN 93-660017 (see Figure 5). Test group
2 shall consist of 3, 10 position standard tin-lead plated samples terminated to 28 AWG wire and
mounted on printed circuit board PN 93-660652; and 3, 10 position standard tin-lead plated
samples terminated to 22 AWG wire and mounted on printed circuit board PN 93-660651 (see
Figure 5). Test group 3 shall consist of 3, 10 position gold plated samples terminated to 22 AWG
wire and mounted on printed circuit board PN 93-660017. Test group 4 shall consist of 5
unmounted 24 position standard tin-lead plated samples terminated to the maximum wire size.
Test group 5 shall consist of 6, 10 position standard tin-lead plated samples terminated to 28 AWG
wire; 6, 10 position standard tin-lead plated samples terminated to 24 AWG wire; and 6, 10
position standard tin-lead plated samples terminated to 22 AWG wire. All samples shall be
unmated and unmounted. Test group 6 shall consist of 5, 6 position .100 inch friction lock tin-lead
plated headers.
Test Sequence
Qualification inspection shall be verified by testing samples as specified in Figure 2.
108-1050
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