MAX5123AEEE+ Maxim Integrated Products, MAX5123AEEE+ Datasheet - Page 18

• Manufacturer Part Number: MAX5123AEEE+
• Description: IC DAC 12BIT LP 3V SER 16-QSOP
• Manufacturer: Maxim Integrated Products

Specifications of MAX5123AEEE+

• Settling Time: 20µs
• Number Of Bits: 12
• Data Interface: Serial
• Number Of Converters: 1
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 667mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-QSOP
• Number Of Dac Outputs: 1
• Resolution: 12 bit
• Interface Type: Serial (SPI)
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Power Dissipation: 667 mW
• Minimum Operating Temperature: - 40 C
• Supply Current: 500 uA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The MAX5122/MAX5123 have multiplying capabilities
within the reference input voltage range specifications.
Figure 13 shows a technique for applying a sinusoidal
input to REF, where the AC signal is offset before being
applied to the reference input.
On power-up, the input and DAC registers are cleared to
either zero (RSTVAL = DGND) or midscale (RSTVAL =
+5V/+3V, 12-Bit, Serial, Force/Sense DACs
with 10ppm/°C Internal Reference
Figure 12. Multiple Devices Share One Common Digital Input (DIN)
Figure 13. External Reference with AC Components
18
REFERENCE
500mVp-p
+5V/
+3V
INPUT
AC
______________________________________________________________________________________
SCLK
CS1
CS2
CS3
DIN
26k
10k
Power-Supply and Bypassing
Using an External Reference
+5V/+3V
AGND
DAC
CS
SCLK
DIN
REF
with AC Components
MAX495
MAX5122
MAX5123
I
Considerations
V
DD
MAX5122
MAX5123
DGND
FB
OUT
CS
SCLK
DIN
MAX5122
MAX5123
II
V
capacitor in parallel with a 0.1µF capacitor to AGND.
Minimize lead lengths to reduce lead inductance.
Digital and AC signals coupling to AGND can create
noise at the output. Connect AGND to the highest quali-
ty ground available. Use proper grounding techniques,
such as a multilayer board with a low-inductance
ground plane. Wire-wrapped boards and sockets are
not recommended. If noise becomes an issue, shield-
ing may be required.
TRANSISTOR COUNT: 3308
SUBSTRATE CONNECTED TO AGND
___________________Chip Information
DD
). Bypass the power supply (V
CS
SCLK
DIN
MAX5123
MAX5122
III
Layout Considerations
DD
TO OTHER
SERIAL DEVICES
) with a 4.7µF