2058703-3 TE Connectivity, 2058703-3 Datasheet - Page 2

• Manufacturer Part Number: 2058703-3
• Description: BOARD-BOARD CONN, RECEPTACLE, 6WAY, 1ROW
• Manufacturer: TE Connectivity
• Series: Hermaphroditicr

Specifications of 2058703-3

• Pitch Spacing: 4mm
• No. Of Rows: 1
• No. Of Contacts: 6
• Gender: Receptacle
• Contact Termination: Surface Mount Horizontal
• Contact Plating: Tin
• Contact Material: Copper Alloy
• Rohs Compliant: Yes
• Product Type: Connector
• Connector Type: Housing
• Sealed: No
• Termination Method To Pc Board: Surface Mount
• Pcb Mount Retention: With
• Pcb Mount Alignment: Without
• Smt Compatible: Yes
• Mount Angle: Right Angle
• Ul File Number: E28476
• Keyed: No
• Make First / Break Last: No
• Mating Retention Type: Latching
• Contact Current Rating, Max (a): 5
• Operating Voltage (vac): 90
• Operating Voltage (vdc): 90
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 4.13 [0.163]
• Centerline (mm [in]): 4.00 [0.157]
• Number Of Positions: 6
• Number Of Rows: 1
• Length (x-axis) (mm [in]): 12.25 [0.482]
• Width (z-axis) (mm [in]): 23.90 [0.940]
• Post-mating Assembly Measurement (mm [in]): 7.5 [0.295]
• Mating Retention: With
• Header Mating Direction: Horizontal
• Pcb Mount Retention Type: Solder Pads
• Tail Plating Material: Matte Tin-Lead over Nickel
• Tail Plating, Thickness (µm [?in]): 5 [191.85]
• Contact Type: Blade/Socket
• Contact Plating, Mating Area, Material: Matte Tin
• Contact Plating, Mating Area, Thickness (µm [?in]): 5 [196.85]
• Stamped And Formed: Yes
• Connector Style: Hermaphroditic
• Mating Alignment: With
• Housing Material: Liquid Crystal Polymer (LCP)
• Housing Color: White
• Ul Flammability Rating: UL 94V-0
• Agency/standard: CSA, UL
• Agency/standard Number: C22.2 No. 182.3-M1987, UL 1977
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Circuit Identification Feature: Without
• Operating Temperature (°c [°f]): -40 – +105 [-40 – +221]
• Applies To: Printed Circuit Board
• Lighting Interconnect Level: Level 2
• Smt Soldering Temperature (°c [°f]): 260 [500]
• Glow Wire Rating: No
• Uv Exposure Rated: No
• Application Use: Board-to-Board
• Packaging Method: Tape & Reel

3.3.
3.4.
3.5.
Initial examination of product.
Final examination of product.
Low Level Contact Resistance
(LLCR).
Insulation resistance.
Withstanding voltage.
Temperature rise vs current.
Resistance to reflow soldering heat. Housing shall be free of deformation
Rev B
Ratings
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!
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Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions.
Test Requirements and Procedures Summary
Test Description
Voltage:
•
•
Current: 6 amperes maximum
Temperature: -40 to 105°C
125 volts AC rms
125 volts DC
Meets requirements of product
drawing and Application
Specification 114-13225.
Meets visual requirements.
18 milliohms maximum initial.
ΔR 5 milliohms maximum.
1 megohm minimum.
One minute hold with no breakdown
or flashover.
30°C maximum temperature rise at
specified current.
and fusion.
See Note.
Figure 1 (continued)
MECHANICAL
ELECTRICAL
Requirement
EIA-364-18.
Visual and dimensional (C of C)
inspection per product drawing.
EIA-364-18.
Visual inspection.
EIA-364-23.
Subject specimens to 100
milliamperes maximum and 20
millivolts maximum open circuit
voltage.
See Figure 3.
EIA-364-21.
500 volts DC, 2 minute hold.
Test between adjacent contacts of
unmated specimens.
EIA-364-20, Condition I.
1500 volts AC at sea level.
Test between adjacent contacts of
unmated specimens.
EIA-364-70, Method 1.
Stabilize at a single current level
until 3 readings at 5 minute intervals
are within 1°C. Energize 100% of
the circuit.
AMP Spec 109-201, Condition B.
Procedure
108-2342
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