1-2013928-2 TE Connectivity, 1-2013928-2 Datasheet - Page 5

• Manufacturer Part Number: 1-2013928-2
• Description: FFC/FPC CONNECTOR, RECEPTACLE 33POS 1ROW
• Manufacturer: TE Connectivity

Specifications of 1-2013928-2

• Gender: Receptacle
• Pitch Spacing: 0.3mm
• No. Of Contacts: 33
• No. Of Rows: 1
• Contact Plating: Gold
• Ffc/fpc Thickness: 0.05mm
• Contact Termination: Surface Mount Horizontal
• Rohs Compliant: Yes
• Product Type: PCB
• Pitch: 0.3 mm
• Number Of Positions / Contacts: 33
• Mounting Angle: Right
• Mounting Style: SMD/SMT
• Housing Material: Thermoplastic
• Contact Material: Copper Alloy
• Voltage Rating: 50 V
• Current Rating: 0.2 A
• Actuation Type: ZIF
• Contact Location: Top Contact
• Termination Style: Solder Pin
• Wire Type: FPC
• Termination Method To Pc Board: Surface Mount
• Pcb Mounting Orientation: Right Angle
• Pcb Mount Alignment: Without
• Pcb Mount Retention: Without
• Actuator Type: Rear Flip (Front Hinge)
• Shrouded: Yes
• Sealed: No
• Strain Relief: Without
• Contact Current Rating, Max (a): 0.2
• Operating Voltage Reference: AC
• Operating Voltage (vac): 50
• Shielded: No
• Tail Orientation: Staggered
• Profile Height (y-axis) (mm [in]): 0.90 [0.035]
• Centerline (mm [in]): 0.30 [0.012]
• Number Of Positions: 33
• Selectively Loaded: No
• Pcb Mount Retention Type: Solder Pads
• Length (x-axis) (mm [in]): 10.40 [0.4094]
• Width (z-axis) (mm [in]): 3.80 [0.1496]
• Contact Plating, Mating Area, Material: Gold
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.1 [3.937]
• Tail Plating Material: Gold
• Tail Plating, Thickness (µm [?in]): 0.1 [3.93]
• Contact Design: Single Beam
• Contact Mating Location: Bottom
• Flex Cable Thickness (mm [in]): 0.2 [0.008]
• Housing Color: Natural
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Circuit Identification Feature: Without
• Operating Temperature (°c [°f]): -25 – +85 [-13 – +185]
• Zif/non-zif: ZIF
• Contact Transmits (typical Application): Signal (Data)
• Pick And Place Cover: Without
• Packaging Method: Tape & Reel

3.5.10
3.5.10
3.5.11 はんだ付け性
3.5.11 Solderability
Rev. A
Para.
項目
衝撃
Physical Shock
Test Items
試験項目
衝撃により 1 μsec. をこえる
不連続導通を生じないこと。
試験後、 物理的異常のなきこと。
総合抵抗 : 130mΩ以下 (終期)
外観に異常なきこと。
No electrical discontinuity
greater than 1μsec. shall
occur.
Termination Resistance:
No physical damage allowed.
95%以上ぬれていること。
Wet solder coverage: 95% Min Solder Temperature: 245±3℃
Product Specification
Fig. 1 （続く） Fig. 1 (CONT.)
規
Requirements
130mΩMax (Final)
格
値
加速度：490m/s
衝撃パルス波形：正弦半波
接続時間：11m/s
速度変化：X,Y,Z軸 正逆方向に各３回、
合計18回、JIS C 0041
Accelerated Velocity: 490m/S
Waveform: Sine half wave
Duration: 11ms
Velocity Charge: 3.4m/S
Number of Drops: 3drops each to normal
and reversed directions of X,Y,Z axes,
totally 18drops.
はんだ温度: 245±3℃
はんだ浸漬時間：3秒以内
Immersion Duration: 3sec Max.
試
Procedures
2
。
験
108-78574
方
5 of 10
法
2
.