2008839-1 TE Connectivity, 2008839-1 Datasheet - Page 5
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2008839-1
Manufacturer Part Number
2008839-1
Description
WIRE-BOARD CONNECTOR RECEPTACLE 1POS 4MM
Manufacturer
TE Connectivity
Series
Poke-Inr
Specifications of 2008839-1
Connector Type
Wire To Board
Contact Termination
Right Angle Through Hole
Gender
Receptacle
No. Of Contacts
1
Pitch Spacing
4mm
Contact Plating
Tin
Rohs Compliant
Yes
Make First / Break Last
No
Sealed
No
Termination Method To Pc Board
Through Hole
Pcb Mount Retention
Without
Pcb Mount Alignment
Without
Smt Compatible
No
Mount Angle
Right Angle
Wire/cable Type
Discrete Wire
Termination Method To Wire/cable
Poke-in
Ul File Number
E28476
Keyed
No
Contact Current Rating, Max (a)
4
Operating Voltage (vac)
250
Operating Voltage (vdc)
250
Wire/cable Size (awg)
18 – 22
Tool-less Wire Termination
Yes
Tail Orientation
In-line
Profile Height (y-axis) (mm [in])
3.90 [0.154]
Number Of Positions
1
Number Of Rows
1
Length (x-axis) (mm [in])
10.50 [0.413]
Width (z-axis) (mm [in])
3.95 [0.156]
Post-mating Assembly Measurement (mm [in])
10.5 [0.413]
Mating Retention
Without
Header Mating Direction
Horizontal
Preloaded
Yes
Tail Plating Material
Matte Tin over Nickel
Tail Plating, Thickness (µm [?in])
3 [118.11]
Contact Type
Socket
Contact Plating, Mating Area, Material
Matte Tin
Contact Plating, Mating Area, Thickness (µm [?in])
3 [118]
Stamped And Formed
Yes
Connector Style
Receptacle
Mating Alignment
Without
Housing Color
Natural
Ul Flammability Rating
UL 94V-0
Pre-designed Cables Available
No
Agency/standard
CSA, UL
Agency/standard Number
C22.2 No. 182.3-M1987, UL 1977
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Circuit Identification Feature
Without
Operating Temperature (°c [°f])
-40 – +105 [-40 – +221]
Applies To
Printed Circuit Board, Wire/Cable
Uv Exposure Rated
No
Glow Wire Rating
No
Pcb Thickness, Recommended (mm [in])
1.57 [0.062]
Accepts Wire Insulation Diameter, Range (mm [in])
2.10 [0.0826]
Lighting Interconnect Level
Level 2
Application Use
Wire-to-Board
Packaging Method
SMT Pocket Tape
4.
4.1.
4.2.
4.3.
4.4.
Rev B
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to
confirm corrective action is required before resubmittal.
Quality Conformance Inspection
The applicable quality inspection plan shall specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Specimen Selection
Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Test groups 1, 2 and 3 shall each consist of 15, two-
position or 30, one-position board mounted specimens terminated to 18 AWG solid copper wire, 18
AWG prebond wire, 18 AWG 16 strand wire, 20 AWG solid copper wire, 20 AWG prebond wire,
and 22 AWG solid copper wire. Test groups 4, 5 and 6 shall each consist of 15 unmounted and
unterminated specimens.
Test Sequence
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
Vibration & Mechanical Shock Mounting Fixture
Figure 3
108-2284
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