353293-9 TE Connectivity, 353293-9 Datasheet - Page 10

• Manufacturer Part Number: 353293-9
• Description: WIRE-BOARD CONN, RECEPTACLE, 9POS, 1.5MM
• Manufacturer: TE Connectivity
• Series: Mini CTr

Specifications of 353293-9

• Connector Type: Wire To Board
• Contact Termination: IDC / IDT
• Gender: Receptacle
• No. Of Contacts: 9
• No. Of Rows: 1
• Pitch Spacing: 1.5mm
• Contact Plating: Tin
• Rohs Compliant: Yes
• Product Type: Receptacles / Sockets - Housings
• Contact Gender: Socket (Female)
• Pitch: 1.5 mm
• Number Of Positions / Contacts: 9
• Number Of Rows: 1
• Termination Style: Crimp
• Contact Material: Phosphor Bronze
• Termination Method To Wire/cable: IDC
• Sealed: No
• Ul File Number: E28476
• Csa File Number: LR 7189-133
• Contact - Rated Current (a): 2
• Operating Voltage Reference: AC/DC, AC, DC
• Operating Voltage (vac): 50
• Operating Voltage (vdc): 50
• Wire/cable Size (awg): 26 – 28
• Profile Height (y-axis) (mm [in]): 6.00 [0.236]
• Number Of Positions: 9
• Centerline (mm [in]): 1.50 [0.059]
• Mating Retention: With
• Length (x-axis) (mm [in]): 15.00 [0.591]
• Width (z-axis) (mm [in]): 3.60 [0.141]
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Pre-Tin
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.2 [7.87]
• Contact Design: Dual Beam
• Mating Alignment: With
• Housing Color: Gray
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Agency/standard: UL, CSA
• Operating Temperature (°c [°f]): -30 – +105 [-22 – +221]
• Applies To: Wire/Cable
• Accepts Wire Insulation Diameter, Range (mm [in]): 0.80 – 0.95 [0.030 – 0.037]
• Application Use: Wire-to-Board, Wire-to-Board / Wire-to-Wire / Wire-to-Panel, Wire-to-Panel, Wire-to-Wire
• Contact Transmits (typical Application): Signal (Data)
• Pick And Place Cover: Without
• Packaging Method: Bag, Box
• Lead Free Status / Rohs Status: Details

ASHL-0005- ES REV B
Examination of Product
Termination Resistance
(Low Level)
Dielectric withstanding Voltage
Insulation Resistance
Temperature Rising
Crimp Tensile Strength
Post Retention Force
Contact Retention Force
Panel Retention Force
Connector Mating/Unmating
Force
Durability
(Repeated Mate/Unmating)
Vibration (Low Frequency)
Physical Shock
Hammering Shocks
Solderability
Resistance to Soldering Heat
Thermal Shock
Humidity (Steady State)
Humidity-Temperature Cycling
Salt Spray
Temperature Life (Heat Aging)
Resistance to Cold
Industrial SO
Industrial H
Industrial Ammonia Gas
Resistance to Solvent
Panel Mounting Force
(a) Numbers indicate sequence in which the tests are performed.
Test Examination
2
S Gas
AMP Shanghai Ltd.
2
Gas
Tyco Electronics
1,5 1,5 1,5 1,5 1,5 1,5 1,5 1,5
2,4 2,4 2,4 2,4 2,4 2,4 2,4 2,4
17 18 19 20 21 22 23 24
3
3
3
10 of 17
Fig.3 (End)
PAGE
3
3
3
Document No.
3
Test Sequence (a)
Test Group
108-5525
3
REV
A
LOC
ES