AD5623RBRMZ-3 Analog Devices Inc, AD5623RBRMZ-3 Datasheet - Page 27
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AD5623RBRMZ-3
Manufacturer Part Number
AD5623RBRMZ-3
Description
IC DAC NANO 12BIT DUAL 10-MSOP
Manufacturer
Analog Devices Inc
Series
nanoDAC™r
Specifications of AD5623RBRMZ-3
Data Interface
Serial
Settling Time
3µs
Number Of Bits
12
Number Of Converters
2
Voltage Supply Source
Single Supply
Power Dissipation (max)
5mW
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
10-MSOP, Micro10™, 10-uMAX, 10-uSOP
Resolution (bits)
12bit
Sampling Rate
287kSPS
Input Channel Type
Serial
Supply Voltage Range - Analog
2.7V To 3.6V, 4.5V To 5.5V
Supply Current
800µA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD5623RBRMZ-3
Manufacturer:
ADI
Quantity:
1 500
Part Number:
AD5623RBRMZ-3
Manufacturer:
ADI/亚德诺
Quantity:
20 000
The power supply to the AD5663R should be bypassed with
10 μF and 0.1 μF capacitors. The capacitors should be located as
close as possible to the device, with the 0.1 μF capacitor ideally
right up against the device. The 10 μF capacitors are the
tantalum bead type. It is important that the 0.1 μF capacitor
have low effective series resistance (ESR) and effective series
inductance (ESI), which is found, for example, in common
ceramic types of capacitors.
This 0.1 μF capacitor provides a low impedance path to ground
for high frequencies caused by transient currents due to internal
logic switching.
Rev. C | Page 27 of 28
The power supply line itself should have as large a trace as
possible to provide a low impedance path and to reduce glitch
effects on the supply line. Clocks and other fast switching
digital signals should be shielded from other parts of the board
by digital ground. Avoid crossover of digital and analog signals,
if possible. When traces cross on opposite sides of the board,
ensure that they run at right angles to each other to reduce
feedthrough effects through the board. The best board layout
technique is the microstrip technique, where the component
side of the board is dedicated to the ground plane only and the
signal traces are placed on the solder side. However, this is not
always possible with a 2-layer board.
AD5623R/AD5643R/AD5663R