T0603F104ZCT MULTICOMP, T0603F104ZCT Datasheet - Page 10

• Manufacturer Part Number: T0603F104ZCT
• Description: CAPACITOR CERAMIC, 0.1UF, 25V, Y5V, 0603
• Manufacturer: MULTICOMP

Specifications of T0603F104ZCT

• Dielectric Characteristic: Y5V
• Capacitance: 0.1µF
• Capacitance Tolerance: +80, -20%
• Voltage Rating: 25VDC
• Capacitor Case Style: 0603
• No. Of Pins: 2
• Capacitor Mounting: SMD
• Rohs Compliant: Yes

Component Layout
When placing / mounting the capacitors / components near an area which is apt to bend or a grid groove on the PC board. It is
advisable to have both electrodes subjected to uniform stresses, or to position the component electrodes at right angles to the grid
groove or bending line.
Figure 3 Component Layout
Uneven mounting density
O: Proper
Probability at which the chip capacitor is broken by the stress on PC board break
A > B = C >D > E
Mounting Density and Spaces
Placements in too narrow spaces between components may cause “ Solder Bridges” during soldering. The minimum space between
components shall be 0.5mm in view of the positioning tolerances of the mounting machines and the dimensional tolerances of the
components and PC boards.
Applications of Solder Resist
Application of Solder Resist are effective to prevent solder bridges and to control amounts of solder on PC boards ( As shown in
Table 2).
Nickel Barrier
Multilayer Ceramic Capacitors
Radial Components
Common lands are
Chip Components
Narrow Spacing
between Chip
connected to
close to Chip
Components
Components
are directly
X: Improper
Recommended Application Examples
Page 10
Examples of Solder Bridges
27/04/06 V1.0