05006-BX101CKZ AVX Corporation, 05006-BX101CKZ Datasheet - Page 42
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05006-BX101CKZ
Manufacturer Part Number
05006-BX101CKZ
Description
CAPACITOR CERAMIC, 100PF, 200V, 0805
Manufacturer
AVX Corporation
Datasheet
1.03028-BP152ZKZ.pdf
(202 pages)
Specifications of 05006-BX101CKZ
Capacitance
100pF
Capacitance Tolerance
± 10%
Voltage Rating
200VDC
Capacitor Case Style
0805
No. Of Pins
2
Capacitor Mounting
SMD
Operating Temperature Range
-55°C To +125°C
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HOW TO ORDER
Style
IDC Low Inductance Capacitors (Tin/Lead)
0612/0508 Interdigitated Capacitors
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
L
Length
Width
Terminal
Pitch
Thickness
Cap
(μF)
WVDC
SIZE
Case Size
2 = 0508
3 = 0612
IDC
0.033
0.047
0.068
0.01
0.10
0.22
0.33
0.47
0.68
3
MM
MM
MM
MM
(in.)
(in.)
(in.)
(in.)
1.0
1.5
2.2
3.3
4
Inductance
6.3
Low
(0.080 ± 0.008)
(0.050 ± 0.008)
(0.020 ± 0.002)
Thin 0508
L
(0.022) MAX.
2.03 ± 0.20
1.27 ± 0.20
0.50 ± 0.05
0.55 MAX.
10
of Terminals
16
Terminals
Number
1 = 8
1
25
4
Y = 16V
4 = 4V
6 = 6.3V
Z = 10V
3 = 25V
Voltage
6.3
(0.080 ± 0.008)
(0.050 ± 0.008)
(0.020 ± 0.002)
(0.037) MAX.
2.03 ± 0.20
1.27 ± 0.20
0.50 ± 0.05
6
0.95 MAX.
0508
Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and board
level decoupling. The equivalent series inductance (ESL) of a single capacitor or an array
of capacitors in parallel determines the response time of a Power Delivery Network (PDN).
A designer can use many standard MLCCs in parallel to reduce ESL or a low ESL Inter-
Digitated Capacitor (IDC) device.
IDCs are typically used on packages of semiconductor products with power levels of 15
watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, ASIC, and ASSP
devices produced on 0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used
on both ceramic and organic package substrates. These low ESL surface mount
capacitors can be placed on the bottom side or the top side of a package substrate.
IDCs are used for board level decoupling of systems with speeds of 300MHz or greater.
Low ESL IDCs free up valuable board space by reducing the number of capacitors
required versus standard MLCCs. There are additional benefits to reducing the number of
capacitors beyond saving board space including higher reliability from a reduction in the
number of components and lower placement costs based on the need for fewer
capacitors.
10
Dielectric
C = X7R
D = X5R
Z = X7S
16
D
25
Number of Zeros
4
2 Sig. Digits +
Capacitance
Code (In pF)
(0.126 ± 0.008)
(0.063 ± 0.008)
(0.031 ± 0.004)
Thin 0612
(0.022) MAX.
3.20 ± 0.20
1.60 ± 0.20
0.80 ± 0.10
6.3
225
0.55 MAX.
http://www.avx.com/docs/catalogs/l2l-l3l.pdf
10
16
Capacitance
Tolerance
Check for up-to-date CV Tables at
M = ±20%
4
M
(0.126 ± 0.008)
(0.063 ± 0.008)
(0.031 ± 0.004)
(0.037) MAX.
3.20 ± 0.20
1.60 ± 0.20
0.80 ± 0.10
6.3
0.95 MAX.
0612
10
Failure Rate
A = N/A
16
A
Consult factory for
additional requirements
Terminations
B = 5%
= X7R
= X5R
= X7S
min.
Lead
B
www.avx.com | 41
1 = 7" Reel
3 = 13" Reel
Packaging
Available
3
A = 0.95 (0.037)
S = 0.55 (0.022)
Max. Thickness
Thickness
mm (in.)
A
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