MT47H32M8BP-37E IT:B TR Micron Technology Inc, MT47H32M8BP-37E IT:B TR Datasheet - Page 18
MT47H32M8BP-37E IT:B TR
Manufacturer Part Number
MT47H32M8BP-37E IT:B TR
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet
1.MT47H32M8BP-37E_ITB_TR.pdf
(128 pages)
Specifications of MT47H32M8BP-37E IT:B TR
Organization
32Mx8
Density
256Mb
Address Bus
15b
Access Time (max)
500ps
Maximum Clock Rate
533MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
160mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
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- Download datasheet (10Mb)
Figure 9: 60-Ball, FBGA Package (8mm x 12mm) – x4, x8
PDF: 09005aef8117c187
256MbDDR2.pdf - Rev. M 7/09 EN
Solder ball material:
Pb-free – (SAC305) SnAgCu
Pb – (Eutectic) SnPbAg
Dimensions apply to solder
balls post-reflow.
Seating plane
60X Ø0.45
0.12 C
0.8 TYP
Note:
C
1. All dimensions are in millimeters.
0.8 TYP
8.0 ±0.15
6.4
C L
C L
18
0.8 ±0.1
8.0
Ball A1 ID
12.0 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
©2003 Micron Technology, Inc. All rights reserved.
Ball A1 ID location
Packaging
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