SMMBFJ177LT1 ON Semiconductor, SMMBFJ177LT1 Datasheet

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SMMBFJ177LT1

Manufacturer Part Number
SMMBFJ177LT1
Description
Manufacturer
ON Semiconductor
Datasheet

Specifications of SMMBFJ177LT1

Channel Type
P
Configuration
Single
Gate-source Voltage (max)
25V
Drain-gate Voltage (max)
25V
Operating Temperature (min)
-55C
Operating Temperature (max)
150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Package Type
SOT-23
Lead Free Status / Rohs Status
Not Compliant
MMBFJ177LT1G
JFET Chopper
P−Channel − Depletion
Features
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0  0.75  0.062 in.
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 4
MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Drain−Gate Voltage
Reverse Gate−Source Voltage
Total Device Dissipation FR− 5 Board
Thermal Resistance,
Junction and Storage Temperature
Compliant
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
(Note 1)
T
Derate above 25°C
Junction−to−Ambient
A
= 25°C
Rating
Symbol
T
V
R
V
J
GS(r)
P
, T
DG
qJA
D
stg
−55 to +150
Value
−25
225
556
1.8
25
1
mW/°C
°C/W
Unit
Vdc
Vdc
mW
°C
†For information on tape and reel specifications,
MMBFJ177LT1G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
Device
(Note: Microdot may be in either location)
1
ORDERING INFORMATION
2
6Y = Specific Device Code
M
G
GATE
MARKING DIAGRAM
3
http://onsemi.com
3
= Date Code*
= Pb−Free Package
1
(Pb−Free)
Package
SOT−23
6Y MG
SOT−23 (TO−236AB)
Publication Order Number:
G
CASE 318−08
1 DRAIN
2 SOURCE
STYLE 10
3000 Tape & Reel
MMBFJ177LT1/D
Shipping

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SMMBFJ177LT1 Summary of contents

Page 1

MMBFJ177LT1G JFET Chopper P−Channel − Depletion Features • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS Rating Drain−Gate Voltage Reverse Gate−Source Voltage Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Gate−Source Breakdown Voltage ( Gate Reverse Current ( Vdc Gate Source Cutoff Voltage ( Vdc CHARACTERISTICS Zero−Gate−Voltage Drain Current (V GS ...

Page 3

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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