AD7847BRZ Analog Devices Inc, AD7847BRZ Datasheet - Page 12
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AD7847BRZ
Manufacturer Part Number
AD7847BRZ
Description
IC DAC 12BIT DUAL MULT 24-SOIC
Manufacturer
Analog Devices Inc
Datasheet
1.AD7837ARZ.pdf
(12 pages)
Specifications of AD7847BRZ
Data Interface
Parallel
Settling Time
4µs
Number Of Bits
12
Number Of Converters
2
Voltage Supply Source
Dual ±
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-SOIC (7.5mm Width)
Resolution (bits)
12bit
Input Channel Type
Parallel
Supply Voltage Range - Analogue
± 14.25V To ± 15.75V
Supply Current
8mA
Digital Ic Case Style
SOIC
No. Of Pins
24
Number Of Channels
2
Resolution
12b
Conversion Rate
250KSPS
Interface Type
Parallel
Single Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (typ)
±15V
Architecture
Segment
Power Supply Requirement
Dual
Output Type
Voltage
Integral Nonlinearity Error
±0.5LSB
Single Supply Voltage (min)
Not RequiredV
Single Supply Voltage (max)
Not RequiredV
Dual Supply Voltage (min)
±14.25V
Dual Supply Voltage (max)
±15.75V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
24
Package Type
SOIC W
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AD7847BRZ
Manufacturer:
ADI/亚德诺
Quantity:
20 000
Part Number:
AD7847BRZ-REEL
Manufacturer:
ADI/亚德诺
Quantity:
20 000
AD7837/AD7847
SEATING
1. LEAD NO. 1 IDENTIFIED BY A DOT OR NOTCH.
2. PLASTIC LEADS WILL EITHER BE SOLDER DIPPED OR TIN LEAD PLATED.
PLANE
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
PIN 1
0.016 (0.41)
0.02 (0.5)
24
1
24-Lead Plastic DIP (N-24)
1.228 (31.19)
1.226 (31.14)
0.11 (2.79)
0.09 (2.28)
0.07 (1.78)
0.05 (1.27)
13
12
AD7837–6502/6809 Interface
Figure 25 shows an interface between the AD7837 and the 6502
or 6809 microprocessor. For the 6502 microprocessor, the φ2
clock is used to generate the WR, while for the 6809 the E sig-
nal is used.
0.01 (0.254)
0.006 (0.15)
0.261
(6.61
PIN 1
0.130 (3.30)
0.128 (3.25)
6502/6809
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. SOIC LEADS WILL EITHER BE TIN PLATED OR SOLDER DIPPED
24
1
0.001
0.03)
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
2 OR E
(1.27)
0.05
R/W
A15
15°
A0
D7
D0
0.32 (8.128)
0°
0.30 (7.62)
0.608 (15.45)
0.596 (15.13)
Dimensions shown in inches and (mm).
0.011 (0.28)
0.009 (0.23)
ADDITIONAL PINS OMITTED FOR CLARITY
OUTLINE DIMENSIONS
0.019 (0.49)
0.014 (0.35)
24-Lead SOIC (R-24)
ADDRESS BUS
SEATING
PLANE
EN
0.096 (2.44)
0.089 (2.26)
ADDRESS
DECODE
13
12
DATA BUS
0.291 (7.39)
0.299 (7.6)
0.225 (5.715)
0.013 (0.32)
0.009 (0.23)
0.125 (3.175)
0.414 (10.52)
0.398 (10.10)
MAX
PIN 1
MIN
1. LEAD NO. 1 IDENTIFIED BY A DOT OR NOTCH.
2. CERDIP LEADS WILL EITHER BE TIN PLATED OR SOLDER DIPPED.
0.021 (0.533)
0.015 (0.381)
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
6
0
TYP
0.03 (0.76)
0.02 (0.51)
24
CS
LDAC
WR
DB7
DB0
1
AD7837
1.290 (32.77) MAX
A0 A1
0.042 (1.067)
0.018 (0.457)
0.110 (2.794)
0.090 (2.286)
24-Lead Cerdip (Q-24)
TYP
0.065 (1.651)
0.055 (1.397)
13
12
0.070 (1.778)
0.020 (0.508)
0.295
(7.493)
MAX
SEATING
PLANE
15°
0.320 (8.128)
0.290 (7.366)
0°
0.012 (0.305)
0.008 (0.203)
TYP
0.180
(4.572)
MAX