LX1971IDUT/R MICROSEMI, LX1971IDUT/R Datasheet - Page 8

• Manufacturer Part Number: LX1971IDUT/R
• Manufacturer: MICROSEMI

Specifications of LX1971IDUT/R

• Lead Free Status / Rohs Status: Compliant

Copyright © 2003
Rev. 1.1b,2005-08-10
S
DU
A1
A
I N T E G R A T E D
8-Pin Miniature Shrink Outline Package (MSOP)
Recommended light footprint pattern
D
b
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: [phone]
L C
e
Top View
A
E1
Side Views
P R O D U C T S
L
Active Area
Required Minimum Light footprint
Bonding / Wafer area
C
P1
P A C K A G E D I M E N S I O N S
E
Examination of
Active Area
B
Active Area
Integrated Products
Microsemi
L1
c
Θ
Wide Range Visible Light Sensor
Note:
P1 represents a possible light footprint and its
dimensions are not subject to strict tolerances. Only
the active area of the device is required to be covered
with light. This larger footprint is designed to ensure
coverage of the device’s active area.
Dim
Dim
A1
E1
P1
L1
Θ
C
A
D
E
S
A
B
b
e
L
c
P
RODUCTION
0.05
0.26
0.13
2.90
4.75
2.90
0.41
MIN
M
M
0.525 BSC
–
0.65 BSC
0.95 BSC
ILLIMETERS
ILLIMETERS
1.22
0.60
0.60
2.5
3°
MAX
D
1.10
0.15
0.41
0.23
3.10
5.05
3.10
0.71
ATA
S
HEET
0.002
0.010
0.005
0.114
0.187
0.114
0.016
MIN
0.025 BSC
0.037 BSC
0.021 BSC
–
I
I
NCHES
NCHES
0.048
0.024
0.024
0.98
3°
0.043
0.006
0.016
0.009
0.122
0.198
0.122
0.028
MAX
LX1971
Page 8