FWIXC1100BD Intel, FWIXC1100BD Datasheet - Page 60
FWIXC1100BD
Manufacturer Part Number
FWIXC1100BD
Description
Manufacturer
Intel
Datasheet
1.FWIXC1100BD.pdf
(96 pages)
Specifications of FWIXC1100BD
Core Operating Frequency
533MHz
Package Type
BGA
Pin Count
492
Mounting
Surface Mount
Operating Temperature (max)
70C
Operating Temperature (min)
0C
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
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Figure 22.
Figure 23.
Intel
Hardware Design Guidelines
60
®
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
8-Layer Stackup
6-Layer Stackup
• Fast and slow transmission line networks have to be considered
• PCB-board velocities
• Board FR4 ~ 4.3
• Target impedance of 50 Ω ± 10%
• Trace width: 5 mils
• Signal Layers (1/2 oz. Cu)
• Power Layer (1 oz. Cu)
• Ground (GND) Layer (1 oz. Cu)
Intel
Solder (Bottom) Side
Solder (Bottom) Side
®
Component (Top) Side
IXP42X product line and IXC1100 control plane processors—General PCB Guide
Component (Top) Side
Data
Data
Data
Data
Data
Data
L1
L2
L3
L4
L5
L6
L1
L2
L3
L4
L5
L6
L7
L8
§ §
4.5 mil
7 mil
7 mil
4.5 mil
~40 mil
4.5 mil
4.5 mil
7 mil
7 mil
17.8 mil
5 mil
5 mil
62 mil
62 mil
Document Number: 252817-008US
POWER
POWER
SIGNAL
SIGNAL
GND
GND
December 2007
Legend
Legend
B2275-02
B2244-02
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