MT4LSDT864AG-10EG2 Micron Technology Inc, MT4LSDT864AG-10EG2 Datasheet - Page 19

• Manufacturer Part Number: MT4LSDT864AG-10EG2
• Manufacturer: Micron Technology Inc

Specifications of MT4LSDT864AG-10EG2

• Main Category: DRAM Module
• Sub-category: SDRAM
• Module Type: 168UDIMM
• Device Core Size: 64b
• Organization: 8Mx64
• Total Density: 64MByte
• Chip Density: 128Mb
• Access Time (max): 6ns
• Maximum Clock Rate: 100MHz
• Operating Supply Voltage (typ): 3.3V
• Operating Current: 560mA
• Number Of Elements: 4
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Operating Temp Range: 0C to 65C
• Operating Temperature Classification: Commercial
• Pin Count: 168
• Mounting: Socket
• Lead Free Status / Rohs Status: Not Compliant

Table 16:
PDF: 09005aef8078bc7c/Source: 09005aef8078bcd3
SD4C4_8_16X64AG.fm - Rev. D 1/07 EN
Parameter/Condition
Auto refresh current: CS# = HIGH;
CKE = HIGH
Self refresh current: CKE ≤ 0.2V
I
Notes: 1, 5, 6, 11, 13; notes appear on page 20; V
DD
Specifications and Conditions – 128MB (Continued)
t
t
RFC =
RFC = 7.81µs
32MB, 64MB, 128MB (x64, SR) 168-Pin SDRAM UDIMM
t
RFC (MIN)
19
DD
Symbol
, V
I
I
I
DD
DD
DD
DD
5
6
7
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Q = +3.3V ±0.3V; DRAM components only
1,140 1,080 1,080
-13E
14
10
Max
-133
14
10
Electrical Specifications
-10E
14
10
©2002 Micron Technology, Inc. All rights reserved.
Units
mA
mA
mA
19, 29, 30
3, 12, 18,
Notes
4